. . "Smart textiles; Integrated sensor modules; Accurate screen printing; Signal evaluation circuits"@en . "1952"^^ . "2"^^ . "0"^^ . "Inteligentn\u00ED textil se senzorov\u00FDmi a komunika\u010Dn\u00EDmi vlastnostmi II"@cs . . . . . . "Intelligent Sensing and Communicating Textile II"@en . "Ov\u011B\u0159en\u00ED technologick\u00FDch postup\u016F, charakterizace stavu, dosa\u017Een\u00E9ho v ultra jemn\u00E9m s\u00EDtotisku, uzav\u0159en\u00ED \u0159e\u0161en\u00ED klasick\u00FDch depozi\u010Dn\u00EDch proces\u016F pro vytv\u00E1\u0159en\u00ED senzorov\u00FDch vrstev, dokon\u010Den\u00ED \u0159e\u0161en\u00ED nov\u00FDch materi\u00E1l\u016F pro senzorov\u00E9 vrstvy. Uzav\u0159en\u00ED proces\u016F integrace stavebn\u00EDch funk\u010Dn\u00EDch prvk\u016F. Modelov\u00E1n\u00ED, zkou\u0161ky a m\u011B\u0159en\u00ED stavebn\u00EDch funk\u010Dn\u00EDch blok\u016F, dlouhodob\u00E9 zkou\u0161ky. Ur\u010Den\u00ED jakosti funk\u010Dn\u00EDch blok\u016F. Zhotoven\u00ED prototyp\u016F funk\u010Dn\u00EDch blok\u016F na korundov\u00FDch substr\u00E1tech. Ur\u010Den\u00ED optimalizovan\u00E9ho technologick\u00E9ho postupu v\u00FDroby. Integrace chytr\u00E9ho mikrosyst\u00E9mu do vybran\u00FDch textiln\u00EDch v\u00FDrobk\u016F (z\u00E1sahov\u00FD oblek hasi\u010De a ochrann\u00FD od\u011Bv do t\u011B\u017Ek\u00FDch provoz\u016F). Vypracov\u00E1n\u00ED zpr\u00E1vy o \u0159e\u0161en\u00ED projektu, technologick\u00FDch, m\u011B\u0159ic\u00EDch a zku\u0161ebn\u00EDch p\u0159edpis\u016F."@cs . . "0"^^ . "2014-04-30+01:00"^^ . "1"^^ . "INTEX II aims to smart sensor system for textile products with new technology for integrated modules fabrication. User groups can be provided with solutions for mobile and flexible surveillance. It solves integrated modules on alumina substrates, interconnections, data acquisition and evaluation. Special modules will ensure temperature, humidity and picked up gases monitoring. They will provide digital signals transferred to the control and display unit, able to signal alarm states, communicate, store data, etc. It solves break through solution of ultra thin film and ultra fine line screen printing process to substitute expensive vacuum technologies and photolithography. Fine stainless steel wire meshes of very high mesh count will be combined with a new generation of emulsions for patterning and printing ultra-thin layers. This process will be used in printing thin conductors on silicon. It is also oriented on solving interconnecting issues between system parts, power supply, antenna, etc."@en . . "0"^^ . . "2013-03-01+01:00"^^ . . "3253"^^ .