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Statements

Subject Item
n2:RIV%2F70883521%3A28110%2F11%3A43865257%21RIV12-MSM-28110___
rdf:type
n14:Vysledek skos:Concept
dcterms:description
Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters. Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.
dcterms:title
Transient of thermal stresses in printed circuit boards Transient of thermal stresses in printed circuit boards
skos:prefLabel
Transient of thermal stresses in printed circuit boards Transient of thermal stresses in printed circuit boards
skos:notation
RIV/70883521:28110/11:43865257!RIV12-MSM-28110___
n14:predkladatel
n17:orjk%3A28110
n3:aktivita
n4:Z
n3:aktivity
Z(MSM7088352102)
n3:cisloPeriodika
3
n3:dodaniDat
n7:2012
n3:domaciTvurceVysledku
n8:3590755 n8:4584783
n3:druhVysledku
n11:J
n3:duvernostUdaju
n9:S
n3:entitaPredkladatele
n19:predkladatel
n3:idSjednocenehoVysledku
235830
n3:idVysledku
RIV/70883521:28110/11:43865257
n3:jazykVysledku
n15:eng
n3:klicovaSlova
Thermal stress, Printed circuit boards, Layered walls.
n3:klicoveSlovo
n6:Thermal%20stress n6:Printed%20circuit%20boards n6:Layered%20walls.
n3:kodStatuVydavatele
US - Spojené státy americké
n3:kontrolniKodProRIV
[A1888ADCA0A8]
n3:nazevZdroje
International Journal of Mechanics
n3:obor
n16:JP
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n7:2011
n3:svazekPeriodika
5
n3:tvurceVysledku
Sýkorová, Libuše Šuba, Oldřich
n3:zamer
n18:MSM7088352102
s:issn
1998-4448
s:numberOfPages
8
n5:organizacniJednotka
28110