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Statements

Subject Item
n2:RIV%2F70883521%3A28110%2F10%3A63509272%21RIV11-MSM-28110___
rdf:type
skos:Concept n18:Vysledek
dcterms:description
Our research was focused on development of novel water-soluble coolant for the multiwire saw slicing of silicon ingots by means of Advance Wire Saw Machine AWSM 3800.6 technology (KUKA S-Base). The coolant exhibited excellent dispersion of abrasive (SiC) in the system, was of high colloidal stability, had no odor, was non toxic for skin, had good biodegradability, exhibited very low foaming at high wire speeds as well as slurry flow rates, and had excellent cleaning capability by conventional technology. System´s high flexibility to vary by simple variables (e.g. abrasive concentration) the thickness of the cut wafers, thus control over all amount of residual cut material give it the high potential for application of eco-design approach in planning of modern mass wafer production lines. Based on the preliminary data from our tests produced wafers were of excellent surface quality (small surface roughness) and good thickness variations. Promising seems to be the ability of upscale of the system for la Our research was focused on development of novel water-soluble coolant for the multiwire saw slicing of silicon ingots by means of Advance Wire Saw Machine AWSM 3800.6 technology (KUKA S-Base). The coolant exhibited excellent dispersion of abrasive (SiC) in the system, was of high colloidal stability, had no odor, was non toxic for skin, had good biodegradability, exhibited very low foaming at high wire speeds as well as slurry flow rates, and had excellent cleaning capability by conventional technology. System´s high flexibility to vary by simple variables (e.g. abrasive concentration) the thickness of the cut wafers, thus control over all amount of residual cut material give it the high potential for application of eco-design approach in planning of modern mass wafer production lines. Based on the preliminary data from our tests produced wafers were of excellent surface quality (small surface roughness) and good thickness variations. Promising seems to be the ability of upscale of the system for la
dcterms:title
Novel water based cutting fluids for saw technology Novel water based cutting fluids for saw technology
skos:prefLabel
Novel water based cutting fluids for saw technology Novel water based cutting fluids for saw technology
skos:notation
RIV/70883521:28110/10:63509272!RIV11-MSM-28110___
n5:aktivita
n15:S
n5:aktivity
S
n5:dodaniDat
n14:2011
n5:domaciTvurceVysledku
n10:1836595 n10:9140077
n5:druhVysledku
n12:D
n5:duvernostUdaju
n20:S
n5:entitaPredkladatele
n17:predkladatel
n5:idSjednocenehoVysledku
275459
n5:idVysledku
RIV/70883521:28110/10:63509272
n5:jazykVysledku
n9:eng
n5:klicovaSlova
saw cutting; coolant; water based slurries; silicon
n5:klicoveSlovo
n11:silicon n11:coolant n11:saw%20cutting n11:water%20based%20slurries
n5:kontrolniKodProRIV
[29637D88C3D7]
n5:mistoKonaniAkce
Rožnov pod Radhoštěm
n5:mistoVydani
Rožnov pod Radhoštěm
n5:nazevZdroje
Proceedings of the 12 th Scientific and Business Conference SILICON 2010
n5:obor
n8:CF
n5:pocetDomacichTvurcuVysledku
2
n5:pocetTvurcuVysledku
3
n5:rokUplatneniVysledku
n14:2010
n5:tvurceVysledku
Lapčík, Lubomír Vojtěchovský, Karel
n5:typAkce
n16:WRD
n5:zahajeniAkce
2010-01-01+01:00
s:numberOfPages
8
n3:hasPublisher
TECON Scientific, spol. s r. o.
n19:isbn
978-80-254-7361-0
n13:organizacniJednotka
28110