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Statements

Subject Item
n2:RIV%2F68407700%3A21670%2F10%3A00175161%21RIV11-MSM-21670___
rdf:type
skos:Concept n16:Vysledek
dcterms:description
Measurements are shown of GeV pions and muons in two 300μm thick, Si Medipix pixel detector assemblies that are stacked on top of each other, with a 25μm thick brass foil in between. In such a radiation imaging semiconductor matrix with a large number of pixels along the particle trail, one can determine local space vectors for the particle trajectory instead of points. This improves pattern recognition and track reconstruction, especially in a crowded environment. Stacking of sensor planes is essential for resolving directional ambiguities. Signal charge sharing can be employed for measuring positions with submicron precision. In the measurements one notices accompanying 'delta' electrons that emerge outside the particle trail, far beyond the boundaries of the 55μm pixel cells. The frequency of such corrupted position measurements is ~ one per 2.5mm of traversed Si. Measurements are shown of GeV pions and muons in two 300μm thick, Si Medipix pixel detector assemblies that are stacked on top of each other, with a 25μm thick brass foil in between. In such a radiation imaging semiconductor matrix with a large number of pixels along the particle trail, one can determine local space vectors for the particle trajectory instead of points. This improves pattern recognition and track reconstruction, especially in a crowded environment. Stacking of sensor planes is essential for resolving directional ambiguities. Signal charge sharing can be employed for measuring positions with submicron precision. In the measurements one notices accompanying 'delta' electrons that emerge outside the particle trail, far beyond the boundaries of the 55μm pixel cells. The frequency of such corrupted position measurements is ~ one per 2.5mm of traversed Si.
dcterms:title
Vectors and submicron precision: redundancy and 3D stacking in silicon pixel detectors Vectors and submicron precision: redundancy and 3D stacking in silicon pixel detectors
skos:prefLabel
Vectors and submicron precision: redundancy and 3D stacking in silicon pixel detectors Vectors and submicron precision: redundancy and 3D stacking in silicon pixel detectors
skos:notation
RIV/68407700:21670/10:00175161!RIV11-MSM-21670___
n3:aktivita
n7:R n7:P n7:Z
n3:aktivity
P(7E08050), P(LC06041), R, Z(MSM6840770029), Z(MSM6840770040)
n3:cisloPeriodika
C06004
n3:dodaniDat
n11:2011
n3:domaciTvurceVysledku
n4:1338226 n4:3746399 n4:9985522 n4:7140398 Heijne, Henricus Maria
n3:druhVysledku
n19:J
n3:duvernostUdaju
n17:S
n3:entitaPredkladatele
n9:predkladatel
n3:idSjednocenehoVysledku
295384
n3:idVysledku
RIV/68407700:21670/10:00175161
n3:jazykVysledku
n13:eng
n3:klicovaSlova
dE/dx detectors; Particle tracking detectors; Pattern recognition, cluster finding, calibration and fitting methods; Detector design and construction technologies and materials
n3:klicoveSlovo
n5:Pattern%20recognition n5:Detector%20design%20and%20construction%20technologies%20and%20materials n5:dE%2Fdx%20detectors n5:Particle%20tracking%20detectors n5:calibration%20and%20fitting%20methods n5:cluster%20finding
n3:kodStatuVydavatele
IT - Italská republika
n3:kontrolniKodProRIV
[1F3C88D9DBB8]
n3:nazevZdroje
Journal of Instrumentation
n3:obor
n14:BG
n3:pocetDomacichTvurcuVysledku
5
n3:pocetTvurcuVysledku
17
n3:projekt
n15:LC06041 n15:7E08050
n3:rokUplatneniVysledku
n11:2010
n3:svazekPeriodika
6
n3:tvurceVysledku
Vykydal, Zdeněk Boltje, D. Campbell, M. Tlustos, L. Wong, W. Heijne, Henricus Maria Pospíšil, Stanislav Idarraga, J. Visschers, J. Vermeulen, J. Visser, J. Leroy, C. Llopard, X. Plackett, R. Tureček, Daniel Jakůbek, Jan Ballabriga, R.
n3:wos
000280526600008
n3:zamer
n10:MSM6840770040 n10:MSM6840770029
s:issn
1748-0221
s:numberOfPages
6
n18:organizacniJednotka
21670