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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F13%3A00210400%21RIV14-MSM-21230___
rdf:type
n12:Vysledek skos:Concept
dcterms:description
Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such as type of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert – nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity. For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples is given by different diameter of the samples, when we used copper wire with diameters 0.3 mm, 0.4 mm and 0.7 mm. Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such as type of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert – nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity. For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples is given by different diameter of the samples, when we used copper wire with diameters 0.3 mm, 0.4 mm and 0.7 mm.
dcterms:title
MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY
skos:prefLabel
MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY
skos:notation
RIV/68407700:21230/13:00210400!RIV14-MSM-21230___
n12:predkladatel
n19:orjk%3A21230
n3:aktivita
n18:S
n3:aktivity
S
n3:dodaniDat
n4:2014
n3:domaciTvurceVysledku
n10:1370642 n10:2578352 n10:7634773
n3:druhVysledku
n17:D
n3:duvernostUdaju
n6:S
n3:entitaPredkladatele
n15:predkladatel
n3:idSjednocenehoVysledku
86756
n3:idVysledku
RIV/68407700:21230/13:00210400
n3:jazykVysledku
n14:eng
n3:klicovaSlova
solder alloys; thermal capacity; wetting balance method
n3:klicoveSlovo
n8:solder%20alloys n8:thermal%20capacity n8:wetting%20balance%20method
n3:kontrolniKodProRIV
[167994CB1D28]
n3:mistoKonaniAkce
Brno
n3:mistoVydani
Brno
n3:nazevZdroje
Proceedings - Electronic Devices and Systems - EDS '13
n3:obor
n20:JA
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
3
n3:rokUplatneniVysledku
n4:2013
n3:tvurceVysledku
Růžička, Daniel Beshajová Pelikánová, Ivana Dušek, Karel
n3:typAkce
n13:EUR
n3:zahajeniAkce
2013-06-26+02:00
s:numberOfPages
4
n16:hasPublisher
Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
n5:isbn
9788021447547
n11:organizacniJednotka
21230