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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F12%3A00199264%21RIV13-MSM-21230___
rdf:type
n4:Vysledek skos:Concept
dcterms:description
The paper presents results of monitoring internal structure of soldered joints, its degradation during elevated temperature treatment (150 °C, up to 3000 hrs.) and influence of those factors on shear strength of the joints. Internal structure of solder joints made of new lead free alloys Sn-0,7Cu, Sn-3,5Ag and Sn-3,7Ag-0,7Cu was observed immediately after reflow using RT analysis. Changes of internal structures of the joints after the ageing were monitored. The main focus was on the presence of intermetallic compounds (IMC) and their genesis after reflow and temperature treatment. Shear strength of soldered joint was measured and the influence of internal structure was discussed. The paper presents results of monitoring internal structure of soldered joints, its degradation during elevated temperature treatment (150 °C, up to 3000 hrs.) and influence of those factors on shear strength of the joints. Internal structure of solder joints made of new lead free alloys Sn-0,7Cu, Sn-3,5Ag and Sn-3,7Ag-0,7Cu was observed immediately after reflow using RT analysis. Changes of internal structures of the joints after the ageing were monitored. The main focus was on the presence of intermetallic compounds (IMC) and their genesis after reflow and temperature treatment. Shear strength of soldered joint was measured and the influence of internal structure was discussed.
dcterms:title
Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties
skos:prefLabel
Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties
skos:notation
RIV/68407700:21230/12:00199264!RIV13-MSM-21230___
n4:predkladatel
n14:orjk%3A21230
n5:aktivita
n21:S
n5:aktivity
S
n5:dodaniDat
n13:2013
n5:domaciTvurceVysledku
n8:1370642 n8:2683393 n8:7389744
n5:druhVysledku
n11:D
n5:duvernostUdaju
n17:S
n5:entitaPredkladatele
n12:predkladatel
n5:idSjednocenehoVysledku
129905
n5:idVysledku
RIV/68407700:21230/12:00199264
n5:jazykVysledku
n10:eng
n5:klicovaSlova
shear strength; lead-free alloys
n5:klicoveSlovo
n16:shear%20strength n16:lead-free%20alloys
n5:kontrolniKodProRIV
[EABB8B2C0617]
n5:mistoKonaniAkce
Brno
n5:mistoVydani
Brno
n5:nazevZdroje
Proceedings of Electronic Devices and Systems EDS 2012
n5:obor
n20:JA
n5:pocetDomacichTvurcuVysledku
3
n5:pocetTvurcuVysledku
3
n5:rokUplatneniVysledku
n13:2012
n5:tvurceVysledku
Urbánek, Jan Dušek, Karel Podzemský, Jiří
n5:typAkce
n18:EUR
n5:zahajeniAkce
2012-06-28+02:00
s:numberOfPages
6
n15:hasPublisher
Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
n19:isbn
978-80-214-4539-0
n7:organizacniJednotka
21230