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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F12%3A00199211%21RIV13-MSM-21230___
rdf:type
skos:Concept n14:Vysledek
dcterms:description
This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment with regard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed. This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment with regard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed.
dcterms:title
Study of the components self-alignment in surface mount technology Study of the components self-alignment in surface mount technology
skos:prefLabel
Study of the components self-alignment in surface mount technology Study of the components self-alignment in surface mount technology
skos:notation
RIV/68407700:21230/12:00199211!RIV13-MSM-21230___
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S
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n4:entitaPredkladatele
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n4:idSjednocenehoVysledku
172214
n4:idVysledku
RIV/68407700:21230/12:00199211
n4:jazykVysledku
n16:eng
n4:klicovaSlova
reflow soldering; surface mount technology; components placement offset
n4:klicoveSlovo
n5:components%20placement%20offset n5:reflow%20soldering n5:surface%20mount%20technology
n4:kontrolniKodProRIV
[FD5F4E8B9277]
n4:mistoKonaniAkce
Bad Aussee
n4:mistoVydani
Wien
n4:nazevZdroje
35th International Spring Seminar on Electronics Technology
n4:obor
n21:JA
n4:pocetDomacichTvurcuVysledku
1
n4:pocetTvurcuVysledku
3
n4:rokUplatneniVysledku
n11:2012
n4:tvurceVysledku
Novák, M. Rudajevová, A. Dušek, Karel
n4:typAkce
n10:WRD
n4:zahajeniAkce
2012-05-09+02:00
s:numberOfPages
4
n9:doi
10.1109/ISSE.2012.6273138
n22:hasPublisher
Technische Universität
n12:isbn
978-1-4673-2241-6
n20:organizacniJednotka
21230