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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F11%3A00184718%21RIV12-MSM-21230___
rdf:type
n10:Vysledek skos:Concept
dcterms:description
Electrically conductive adhesive based on epoxy resin matrix with silver filler was used for formation of adhesive joints, which were aged at the higher temperature and humidity. Resistance and nonlinearity of current vs. voltage characteristic were measured and results found before and after ageing were compared. It was found that combined ageing causes increase of resistance and non-linearity of adhesive joints. Electrically conductive adhesive based on epoxy resin matrix with silver filler was used for formation of adhesive joints, which were aged at the higher temperature and humidity. Resistance and nonlinearity of current vs. voltage characteristic were measured and results found before and after ageing were compared. It was found that combined ageing causes increase of resistance and non-linearity of adhesive joints.
dcterms:title
Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging
skos:prefLabel
Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging Resistance and Non-Linearity of Electrically Conductive Adhesives Aged by Thermal-Humidity Combined Aging
skos:notation
RIV/68407700:21230/11:00184718!RIV12-MSM-21230___
n10:predkladatel
n11:orjk%3A21230
n3:aktivita
n16:S
n3:aktivity
S
n3:dodaniDat
n12:2012
n3:domaciTvurceVysledku
n9:9533478 n9:9716254
n3:druhVysledku
n14:D
n3:duvernostUdaju
n21:S
n3:entitaPredkladatele
n6:predkladatel
n3:idSjednocenehoVysledku
226727
n3:idVysledku
RIV/68407700:21230/11:00184718
n3:jazykVysledku
n13:eng
n3:klicovaSlova
Correlation; Adhesives; Aging; Resistivity; Non-Linearity
n3:klicoveSlovo
n15:Correlation n15:Non-Linearity n15:Resistivity n15:Adhesives n15:Aging
n3:kontrolniKodProRIV
[155BE891FE77]
n3:mistoKonaniAkce
Timisoara
n3:mistoVydani
Timisoara
n3:nazevZdroje
2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging
n3:obor
n19:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n12:2011
n3:tvurceVysledku
Barto, Seba Mach, Pavel
n3:typAkce
n4:WRD
n3:zahajeniAkce
2011-10-20+02:00
s:numberOfPages
2
n7:hasPublisher
Politehnica University of Timisoara
n20:isbn
978-1-4577-1275-3
n18:organizacniJednotka
21230