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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F11%3A00181812%21RIV12-MSM-21230___
rdf:type
skos:Concept n16:Vysledek
dcterms:description
Article deals with design, construction and usage of a device for mechanic bending of assembled printed circuits boards. Device is designed to test the mechanical reliability of SMD components connection on PCB. Device is specifically focused on mechanical tests of solder joints. Article deals with design, construction and usage of a device for mechanic bending of assembled printed circuits boards. Device is designed to test the mechanical reliability of SMD components connection on PCB. Device is specifically focused on mechanical tests of solder joints.
dcterms:title
Device for Mechanical Bending of Assembled Printed Circuit Boards Device for Mechanical Bending of Assembled Printed Circuit Boards
skos:prefLabel
Device for Mechanical Bending of Assembled Printed Circuit Boards Device for Mechanical Bending of Assembled Printed Circuit Boards
skos:notation
RIV/68407700:21230/11:00181812!RIV12-MSM-21230___
n16:predkladatel
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n5:aktivity
Z(MSM6840770021)
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n6:2012
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n14:D
n5:duvernostUdaju
n8:S
n5:entitaPredkladatele
n13:predkladatel
n5:idSjednocenehoVysledku
194149
n5:idVysledku
RIV/68407700:21230/11:00181812
n5:jazykVysledku
n18:eng
n5:klicovaSlova
device, mechanical bending, solder joint
n5:klicoveSlovo
n12:solder%20joint n12:device n12:mechanical%20bending
n5:kontrolniKodProRIV
[43377D3309F3]
n5:mistoKonaniAkce
Brno
n5:mistoVydani
Brno
n5:nazevZdroje
Electronic Devices and Systems, IMAPS CS International Conference 2011 Proceedings
n5:obor
n10:JA
n5:pocetDomacichTvurcuVysledku
1
n5:pocetTvurcuVysledku
2
n5:rokUplatneniVysledku
n6:2011
n5:tvurceVysledku
Gřunděl, J. Dušek, Karel
n5:typAkce
n9:EUR
n5:zahajeniAkce
2011-06-22+02:00
n5:zamer
n15:MSM6840770021
s:numberOfPages
4
n21:hasPublisher
Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
n7:isbn
978-80-214-4303-7
n19:organizacniJednotka
21230