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Namespace Prefixes

PrefixIRI
n15http://linked.opendata.cz/ontology/domain/vavai/riv/typAkce/
dctermshttp://purl.org/dc/terms/
n17http://purl.org/net/nknouf/ns/bibtex#
n3http://localhost/temp/predkladatel/
n14http://linked.opendata.cz/resource/domain/vavai/riv/tvurce/
n8http://linked.opendata.cz/ontology/domain/vavai/
n19http://linked.opendata.cz/resource/domain/vavai/zamer/
n11https://schema.org/
shttp://schema.org/
skoshttp://www.w3.org/2004/02/skos/core#
n4http://linked.opendata.cz/ontology/domain/vavai/riv/
n18http://linked.opendata.cz/resource/domain/vavai/vysledek/RIV%2F68407700%3A21230%2F10%3A00173027%21RIV12-MSM-21230___/
n2http://linked.opendata.cz/resource/domain/vavai/vysledek/
rdfhttp://www.w3.org/1999/02/22-rdf-syntax-ns#
n6http://linked.opendata.cz/ontology/domain/vavai/riv/klicoveSlovo/
n20http://linked.opendata.cz/ontology/domain/vavai/riv/duvernostUdaju/
xsdhhttp://www.w3.org/2001/XMLSchema#
n21http://linked.opendata.cz/ontology/domain/vavai/riv/aktivita/
n5http://linked.opendata.cz/ontology/domain/vavai/riv/jazykVysledku/
n12http://linked.opendata.cz/ontology/domain/vavai/riv/obor/
n7http://linked.opendata.cz/ontology/domain/vavai/riv/druhVysledku/
n9http://reference.data.gov.uk/id/gregorian-year/

Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F10%3A00173027%21RIV12-MSM-21230___
rdf:type
n8:Vysledek skos:Concept
dcterms:description
Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications of the adhesive, it may give a clue to better thermal processing of the adhesive while curing. Thermal analysis of totally nine types of adhesive modifications was performed, particularly the influence of carbon nanotubes addition, silver nanoparticles and colloidal silver was observed. In our tests, both one-component and two-component adhesives were used. Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications of the adhesive, it may give a clue to better thermal processing of the adhesive while curing. Thermal analysis of totally nine types of adhesive modifications was performed, particularly the influence of carbon nanotubes addition, silver nanoparticles and colloidal silver was observed. In our tests, both one-component and two-component adhesives were used.
dcterms:title
Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive
skos:prefLabel
Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive
skos:notation
RIV/68407700:21230/10:00173027!RIV12-MSM-21230___
n4:aktivita
n21:Z
n4:aktivity
Z(MSM6840770021)
n4:dodaniDat
n9:2012
n4:domaciTvurceVysledku
n14:6130569 n14:9716254 n14:4718267
n4:druhVysledku
n7:D
n4:duvernostUdaju
n20:S
n4:entitaPredkladatele
n18:predkladatel
n4:idSjednocenehoVysledku
292779
n4:idVysledku
RIV/68407700:21230/10:00173027
n4:jazykVysledku
n5:eng
n4:klicovaSlova
thermomechanical analysis; electrically conductive adhesive; carbon nanotubes; silver nanoparticles; colloidal silver
n4:klicoveSlovo
n6:colloidal%20silver n6:electrically%20conductive%20adhesive n6:silver%20nanoparticles n6:carbon%20nanotubes n6:thermomechanical%20analysis
n4:kontrolniKodProRIV
[B0D611389A6F]
n4:mistoKonaniAkce
Warsaw
n4:mistoVydani
New York
n4:nazevZdroje
33rd International Spring Seminar on Electronics Technology
n4:obor
n12:JA
n4:pocetDomacichTvurcuVysledku
3
n4:pocetTvurcuVysledku
3
n4:rokUplatneniVysledku
n9:2010
n4:tvurceVysledku
Bušek, David Mach, Pavel Pilarčíková, Ivana
n4:typAkce
n15:WRD
n4:zahajeniAkce
2010-05-12+02:00
n4:zamer
n19:MSM6840770021
s:numberOfPages
4
n17:hasPublisher
IEEE
n11:isbn
978-1-4244-7849-1
n3:organizacniJednotka
21230