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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F10%3A00172788%21RIV11-MSM-21230___
rdf:type
skos:Concept n20:Vysledek
dcterms:description
This article describes preparation of vibration experiments aimed at the reliability of joints manufactured using leadfree soldering and electrically conductive adhesives. To facilitate the experiment, a holder for experimental circuit board had to be designed and manufactured. At the same time, it was needed to set up measurement of acceleration of the specimens to ensure controlled conditions and to calibrate the vibrators. The result of this effort is a holder, designed specifically for standardized circuit boards used at author's department for a wide range of various experiments connected with surface mount technologies. The holder allows vibrations along three axes. Measurement of vibrations is being performed using simple chip accelerometers, covering all three axes. This article describes preparation of vibration experiments aimed at the reliability of joints manufactured using leadfree soldering and electrically conductive adhesives. To facilitate the experiment, a holder for experimental circuit board had to be designed and manufactured. At the same time, it was needed to set up measurement of acceleration of the specimens to ensure controlled conditions and to calibrate the vibrators. The result of this effort is a holder, designed specifically for standardized circuit boards used at author's department for a wide range of various experiments connected with surface mount technologies. The holder allows vibrations along three axes. Measurement of vibrations is being performed using simple chip accelerometers, covering all three axes.
dcterms:title
Preparation of Vibration Tests of Electrically Conductive Adhesives and Leadfree Solders Preparation of Vibration Tests of Electrically Conductive Adhesives and Leadfree Solders
skos:prefLabel
Preparation of Vibration Tests of Electrically Conductive Adhesives and Leadfree Solders Preparation of Vibration Tests of Electrically Conductive Adhesives and Leadfree Solders
skos:notation
RIV/68407700:21230/10:00172788!RIV11-MSM-21230___
n3:aktivita
n8:Z
n3:aktivity
Z(MSM6840770021)
n3:dodaniDat
n9:2011
n3:domaciTvurceVysledku
n7:6661378 n7:7389744 n7:4766695
n3:druhVysledku
n4:D
n3:duvernostUdaju
n11:S
n3:entitaPredkladatele
n12:predkladatel
n3:idSjednocenehoVysledku
281403
n3:idVysledku
RIV/68407700:21230/10:00172788
n3:jazykVysledku
n18:eng
n3:klicovaSlova
Leadfree Solder; Electrically Conductive Adhesive; Vibrations
n3:klicoveSlovo
n5:Electrically%20Conductive%20Adhesive n5:Leadfree%20Solder n5:Vibrations
n3:kontrolniKodProRIV
[A3D169241A8D]
n3:mistoKonaniAkce
Plzeň
n3:mistoVydani
Pilsen
n3:nazevZdroje
Applied Electronic 2010
n3:obor
n21:JA
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
3
n3:rokUplatneniVysledku
n9:2010
n3:tvurceVysledku
Tučan, Marek Urbánek, Jan Žák, Pavel
n3:typAkce
n19:EUR
n3:zahajeniAkce
2010-09-08+02:00
n3:zamer
n17:MSM6840770021
s:issn
1803-7232
s:numberOfPages
4
n13:hasPublisher
Západočeská univerzita v Plzni
n14:isbn
978-80-7043-865-7
n16:organizacniJednotka
21230