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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F09%3A00162950%21RIV10-MSM-21230___
rdf:type
n16:Vysledek skos:Concept
dcterms:description
This article presents results of research aimed at the influence of manufacturing process of electronic device on creation and growth of intermetallic layers in the solder. These layers can significantly influence performance and reliability of the entire electronic device. Exact beahvior of intermetallic compounds under various conditions is not yet fully known - that is also one of the reasons sensitive devices for aerospace, medical or military industries are allowed to still use solders containing lead - and it is important to gain such knowledge, before the leadfree solders are allowed into such applications. To further this goal, this research compared both experimentally and theoretically various situations, that may be encountered during the electronic devices production. This article presents results of research aimed at the influence of manufacturing process of electronic device on creation and growth of intermetallic layers in the solder. These layers can significantly influence performance and reliability of the entire electronic device. Exact beahvior of intermetallic compounds under various conditions is not yet fully known - that is also one of the reasons sensitive devices for aerospace, medical or military industries are allowed to still use solders containing lead - and it is important to gain such knowledge, before the leadfree solders are allowed into such applications. To further this goal, this research compared both experimentally and theoretically various situations, that may be encountered during the electronic devices production.
dcterms:title
Influence of Reflow Temperature Profile on Properties of Soldered Joints Influence of Reflow Temperature Profile on Properties of Soldered Joints
skos:prefLabel
Influence of Reflow Temperature Profile on Properties of Soldered Joints Influence of Reflow Temperature Profile on Properties of Soldered Joints
skos:notation
RIV/68407700:21230/09:00162950!RIV10-MSM-21230___
n3:aktivita
n14:Z
n3:aktivity
Z(MSM6840770021)
n3:dodaniDat
n6:2010
n3:domaciTvurceVysledku
n15:7389744 n15:6661378
n3:druhVysledku
n8:D
n3:duvernostUdaju
n18:S
n3:entitaPredkladatele
n13:predkladatel
n3:idSjednocenehoVysledku
319328
n3:idVysledku
RIV/68407700:21230/09:00162950
n3:jazykVysledku
n10:eng
n3:klicovaSlova
soldering; leadfree; temperature profile
n3:klicoveSlovo
n7:temperature%20profile n7:leadfree n7:soldering
n3:kontrolniKodProRIV
[415818BD4A21]
n3:mistoKonaniAkce
Brno
n3:mistoVydani
Brno
n3:nazevZdroje
Electronic Devices and Systems, IMAPS CS International Conference 2009 Proceedings
n3:obor
n11:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n6:2009
n3:tvurceVysledku
Urbánek, Jan Tučan, Marek
n3:typAkce
n9:EUR
n3:zahajeniAkce
2009-09-02+02:00
n3:zamer
n21:MSM6840770021
s:numberOfPages
6
n20:hasPublisher
Vysoké učení technické v Brně. Fakulta elektrotechniky a informatiky
n17:isbn
978-80-214-3933-7
n19:organizacniJednotka
21230