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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F09%3A00159455%21RIV12-MSM-21230___
rdf:type
n9:Vysledek skos:Concept
rdfs:seeAlso
http://www.imaps.cz/eds2009/
dcterms:description
In this article, the changes of the electrical resistance of mechanically stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) against reflow temperature profiles are compared. In this article, the changes of the electrical resistance of mechanically stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) against reflow temperature profiles are compared.
dcterms:title
Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints
skos:prefLabel
Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints
skos:notation
RIV/68407700:21230/09:00159455!RIV12-MSM-21230___
n4:aktivita
n6:Z
n4:aktivity
Z(MSM6840770021)
n4:dodaniDat
n20:2012
n4:domaciTvurceVysledku
n13:1370642
n4:druhVysledku
n17:D
n4:duvernostUdaju
n11:S
n4:entitaPredkladatele
n5:predkladatel
n4:idSjednocenehoVysledku
319430
n4:idVysledku
RIV/68407700:21230/09:00159455
n4:jazykVysledku
n16:eng
n4:klicovaSlova
Temperature profile; soldered joint; mechanical stress
n4:klicoveSlovo
n8:soldered%20joint n8:mechanical%20stress n8:Temperature%20profile
n4:kontrolniKodProRIV
[AD8D2C30EEF8]
n4:mistoKonaniAkce
Brno
n4:mistoVydani
Brno
n4:nazevZdroje
Electronic Devices and Systems, IMAPS CS International Conference 2009 Proceedings
n4:obor
n12:JA
n4:pocetDomacichTvurcuVysledku
1
n4:pocetTvurcuVysledku
2
n4:rokUplatneniVysledku
n20:2009
n4:tvurceVysledku
Urbánek, M. Dušek, Karel
n4:typAkce
n21:EUR
n4:zahajeniAkce
2009-09-02+02:00
n4:zamer
n22:MSM6840770021
s:numberOfPages
5
n3:hasPublisher
Vysoké učení technické v Brně. Fakulta elektrotechniky a informatiky
n19:isbn
978-80-214-3933-7
n15:organizacniJednotka
21230