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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F08%3A00148250%21RIV12-MSM-21230___
rdf:type
n17:Vysledek skos:Concept
dcterms:description
Image analysis of leadfree soldered joints subjected to mechanical stress and thermal aging. Image analysis of leadfree soldered joints subjected to mechanical stress and thermal aging.
dcterms:title
Image analysis of soldered joints subjected to mechanical stress Image analysis of soldered joints subjected to mechanical stress
skos:prefLabel
Image analysis of soldered joints subjected to mechanical stress Image analysis of soldered joints subjected to mechanical stress
skos:notation
RIV/68407700:21230/08:00148250!RIV12-MSM-21230___
n3:aktivita
n9:Z
n3:aktivity
Z(MSM6840770021)
n3:dodaniDat
n16:2012
n3:domaciTvurceVysledku
n14:6661378 n14:7389744 n14:1370642
n3:druhVysledku
n19:D
n3:duvernostUdaju
n13:S
n3:entitaPredkladatele
n10:predkladatel
n3:idSjednocenehoVysledku
371407
n3:idVysledku
RIV/68407700:21230/08:00148250
n3:jazykVysledku
n21:eng
n3:klicovaSlova
intermetallic compounds; leadfree soldering; mechanical stress
n3:klicoveSlovo
n5:mechanical%20stress n5:intermetallic%20compounds n5:leadfree%20soldering
n3:kontrolniKodProRIV
[9DE2A0433102]
n3:mistoKonaniAkce
Pilsen
n3:mistoVydani
Pilsen
n3:nazevZdroje
Applied Electronics 2008
n3:obor
n18:JA
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
3
n3:rokUplatneniVysledku
n16:2008
n3:tvurceVysledku
Dušek, Karel Tučan, Marek Urbánek, Jan
n3:typAkce
n11:EUR
n3:zahajeniAkce
2008-09-10+02:00
n3:zamer
n15:MSM6840770021
s:numberOfPages
4
n20:hasPublisher
Západočeská univerzita v Plzni
n7:isbn
978-80-7043-654-7
n6:organizacniJednotka
21230