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Statements

Subject Item
n2:RIV%2F68407700%3A21230%2F08%3A00147978%21RIV12-MSM-21230___
rdf:type
n8:Vysledek skos:Concept
dcterms:description
This article delas with image analysis of the soldered joints. resulting Images sowed several differences concerning formation and propagation of cracks in joints that underwent thermal and mechanical stress. This article delas with image analysis of the soldered joints. resulting Images sowed several differences concerning formation and propagation of cracks in joints that underwent thermal and mechanical stress.
dcterms:title
Cracks in Soldered Joints Subjected to Mechanical Stress Cracks in Soldered Joints Subjected to Mechanical Stress
skos:prefLabel
Cracks in Soldered Joints Subjected to Mechanical Stress Cracks in Soldered Joints Subjected to Mechanical Stress
skos:notation
RIV/68407700:21230/08:00147978!RIV12-MSM-21230___
n4:aktivita
n7:Z
n4:aktivity
Z(MSM6840770021)
n4:dodaniDat
n10:2012
n4:domaciTvurceVysledku
n17:1370642 n17:6661378 n17:7389744
n4:druhVysledku
n18:D
n4:duvernostUdaju
n6:S
n4:entitaPredkladatele
n14:predkladatel
n4:idSjednocenehoVysledku
361508
n4:idVysledku
RIV/68407700:21230/08:00147978
n4:jazykVysledku
n15:eng
n4:klicovaSlova
Image Analysis; Mechanical and Temperature stress; Soldered joints
n4:klicoveSlovo
n5:Mechanical%20and%20Temperature%20stress n5:Image%20Analysis n5:Soldered%20joints
n4:kontrolniKodProRIV
[F9CF49A57C29]
n4:mistoKonaniAkce
Brno
n4:mistoVydani
Brno
n4:nazevZdroje
Electronics Devices and Systems Proceedings
n4:obor
n11:JA
n4:pocetDomacichTvurcuVysledku
3
n4:pocetTvurcuVysledku
3
n4:rokUplatneniVysledku
n10:2008
n4:tvurceVysledku
Dušek, Karel Urbánek, Jan Tučan, Marek
n4:typAkce
n21:EUR
n4:zahajeniAkce
2008-09-10+02:00
n4:zamer
n16:MSM6840770021
s:numberOfPages
6
n19:hasPublisher
Vysoké učení technické v Brně
n20:isbn
978-80-214-3717-3
n13:organizacniJednotka
21230