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Statements

Subject Item
n2:RIV%2F68081723%3A_____%2F02%3A07023114%21RIV%2F2003%2FAV0%2FA07003%2FN
rdf:type
skos:Concept n10:Vysledek
dcterms:description
The creep behaviour in ODS Copper is investigated in two distincly different temperature intervals,the lower temperature interval LTI(673-773 K) and the higher temperature interval HTI(923-1023 K).In both intervals the creep exhibits threshold behaviour. In LTI, the creep strain rate is controlled by the dislocation core diffusion in the ODS matrix and the true stress exponent is close to 7. In HTI the creep strain rate is found to be controlled by lattice self-diffusion in the ODS matrix and the true exponent is 5. In both intervals the differences of apparent and true activation energies are explained by observed temperature dependences of true threshold stresses. The creep behaviour in ODS Copper is investigated in two distincly different temperature intervals,the lower temperature interval LTI(673-773 K) and the higher temperature interval HTI(923-1023 K).In both intervals the creep exhibits threshold behaviour. In LTI, the creep strain rate is controlled by the dislocation core diffusion in the ODS matrix and the true stress exponent is close to 7. In HTI the creep strain rate is found to be controlled by lattice self-diffusion in the ODS matrix and the true exponent is 5. In both intervals the differences of apparent and true activation energies are explained by observed temperature dependences of true threshold stresses.
dcterms:title
High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles. High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles.
skos:prefLabel
High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles. High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles.
skos:notation
RIV/68081723:_____/02:07023114!RIV/2003/AV0/A07003/N
n3:strany
357;378
n3:aktivita
n4:P n4:Z
n3:aktivity
P(IBS2041001), Z(AV0Z2041904)
n3:cisloPeriodika
4
n3:dodaniDat
n6:2003
n3:domaciTvurceVysledku
n7:3249514 n7:7680546
n3:druhVysledku
n18:J
n3:duvernostUdaju
n11:S
n3:entitaPredkladatele
n15:predkladatel
n3:idSjednocenehoVysledku
647564
n3:idVysledku
RIV/68081723:_____/02:07023114
n3:jazykVysledku
n17:eng
n3:klicovaSlova
Copper alloy; Creep; Powder processing
n3:klicoveSlovo
n8:Powder%20processing n8:Copper%20alloy n8:Creep
n3:kodStatuVydavatele
CZ - Česká republika
n3:kontrolniKodProRIV
[555D44CD7484]
n3:nazevZdroje
Acta Technica ČSAV
n3:obor
n12:JI
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
3
n3:pocetUcastnikuAkce
0
n3:pocetZahranicnichUcastnikuAkce
0
n3:projekt
n16:IBS2041001
n3:rokUplatneniVysledku
n6:2002
n3:svazekPeriodika
47
n3:tvurceVysledku
Čadek, Josef Zhu, S. J. Kuchařová, Květa
n3:zamer
n13:AV0Z2041904
s:issn
0001-7043
s:numberOfPages
22