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Statements

Subject Item
n2:RIV%2F68081723%3A_____%2F02%3A07023100%21RIV%2F2003%2FAV0%2FA07003%2FN
rdf:type
skos:Concept n14:Vysledek
dcterms:description
The creep data for copper strengthened with fine alumina particles - a commercial GlidCop Al-15 alloy, presented by Broyles et al. - are interpreted in terms of the true threshold stress. It is shown that at high testing temperatures 973 and 998 K the minimum creep strain rate is apparently controlled by lattice self-diffusion in the alloy matrix - copper - and that the true stress exponent of minimum creep strain rate is very close to that reported for copper, i.e. close to 5. At much lower testing temperatures of 748 and 773 K, the minimum creep strain rate is found to be controlled by the dislocation core diffusion in copper, and, accordingly, the true stress exponent of minimum creep strain rate is close to 7. The creep data available for these two temperatures made it possible to prove that the apparent activation energy of creep is much higher than the activation enthalpy of dislocation core diffusion, which is essentially due to the temperature dependence of the true threshold stress; the contr The creep data for copper strengthened with fine alumina particles - a commercial GlidCop Al-15 alloy, presented by Broyles et al. - are interpreted in terms of the true threshold stress. It is shown that at high testing temperatures 973 and 998 K the minimum creep strain rate is apparently controlled by lattice self-diffusion in the alloy matrix - copper - and that the true stress exponent of minimum creep strain rate is very close to that reported for copper, i.e. close to 5. At much lower testing temperatures of 748 and 773 K, the minimum creep strain rate is found to be controlled by the dislocation core diffusion in copper, and, accordingly, the true stress exponent of minimum creep strain rate is close to 7. The creep data available for these two temperatures made it possible to prove that the apparent activation energy of creep is much higher than the activation enthalpy of dislocation core diffusion, which is essentially due to the temperature dependence of the true threshold stress; the contr
dcterms:title
Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress. Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress.
skos:prefLabel
Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress. Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress.
skos:notation
RIV/68081723:_____/02:07023100!RIV/2003/AV0/A07003/N
n6:strany
231;241
n6:aktivita
n11:P n11:Z
n6:aktivity
P(IBS2041001), Z(AV0Z2041904)
n6:cisloPeriodika
4
n6:dodaniDat
n7:2003
n6:domaciTvurceVysledku
n8:7680546 n8:3249514
n6:druhVysledku
n12:J
n6:duvernostUdaju
n15:S
n6:entitaPredkladatele
n16:predkladatel
n6:idSjednocenehoVysledku
641894
n6:idVysledku
RIV/68081723:_____/02:07023100
n6:jazykVysledku
n17:eng
n6:klicovaSlova
Copper alloy; Creep
n6:klicoveSlovo
n13:Copper%20alloy n13:Creep
n6:kodStatuVydavatele
SK - Slovenská republika
n6:kontrolniKodProRIV
[3186DAB0512D]
n6:nazevZdroje
KOVOVÉ MATERIÁLY
n6:obor
n18:JG
n6:pocetDomacichTvurcuVysledku
2
n6:pocetTvurcuVysledku
2
n6:pocetUcastnikuAkce
0
n6:pocetZahranicnichUcastnikuAkce
0
n6:projekt
n10:IBS2041001
n6:rokUplatneniVysledku
n7:2002
n6:svazekPeriodika
40
n6:tvurceVysledku
Kuchařová, Květa Čadek, Josef
n6:zamer
n9:AV0Z2041904
s:issn
0023-432X
s:numberOfPages
11