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Statements

Subject Item
n2:RIV%2F61989100%3A27360%2F13%3A86088412%21RIV14-MSM-27360___
rdf:type
skos:Concept n8:Vysledek
dcterms:description
Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt will be presented for the case of planar dissolution. The main intention was to study experimentally the copper dissolution in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu plate dissolving in the solder melt were carried out at various conditions. Concentration profiles of elements and thickness of layers of phases were determined by SEM and X-ray microanalyses (WDX, EDX) of specimens after their heating. Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt will be presented for the case of planar dissolution. The main intention was to study experimentally the copper dissolution in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu plate dissolving in the solder melt were carried out at various conditions. Concentration profiles of elements and thickness of layers of phases were determined by SEM and X-ray microanalyses (WDX, EDX) of specimens after their heating.
dcterms:title
Study of interaction between copper and melt of lead-free solders Study of interaction between copper and melt of lead-free solders
skos:prefLabel
Study of interaction between copper and melt of lead-free solders Study of interaction between copper and melt of lead-free solders
skos:notation
RIV/61989100:27360/13:86088412!RIV14-MSM-27360___
n8:predkladatel
n9:orjk%3A27360
n3:aktivita
n15:P
n3:aktivity
P(ED0040/01/01), P(OC08032)
n3:cisloPeriodika
4
n3:dodaniDat
n5:2014
n3:domaciTvurceVysledku
n14:3580709 n14:6199593
n3:druhVysledku
n10:J
n3:duvernostUdaju
n7:S
n3:entitaPredkladatele
n4:predkladatel
n3:idSjednocenehoVysledku
108718
n3:idVysledku
RIV/61989100:27360/13:86088412
n3:jazykVysledku
n18:eng
n3:klicovaSlova
diffusion; intermetallic compounds; silver; tin; copper; lead-free solders
n3:klicoveSlovo
n6:diffusion n6:intermetallic%20compounds n6:silver n6:lead-free%20solders n6:tin n6:copper
n3:kodStatuVydavatele
HR - Chorvatská republika
n3:kontrolniKodProRIV
[DF77F66D9AAB]
n3:nazevZdroje
Metalurgija = Metallurgy
n3:obor
n16:JG
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
4
n3:projekt
n13:OC08032 n13:ED0040%2F01%2F01
n3:rokUplatneniVysledku
n5:2013
n3:svazekPeriodika
52
n3:tvurceVysledku
Drápala, Jaromír Kostiuková, Gabriela Jopek, P. Kubíček, P.
n3:wos
000318059400019
s:issn
0543-5846
s:numberOfPages
3
n19:organizacniJednotka
27360