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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F14%3A43922441%21RIV15-MSM-23220___
rdf:type
n14:Vysledek skos:Concept
rdfs:seeAlso
http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=6887570
dcterms:description
This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing process. Gas-tight retort, we used for this specific substrate manufacturing process, is also described in this paper. Mechanical properties of substrates such as adhesion, as well as thermal and electrical properties, were tested in detail. This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing process. Gas-tight retort, we used for this specific substrate manufacturing process, is also described in this paper. Mechanical properties of substrates such as adhesion, as well as thermal and electrical properties, were tested in detail.
dcterms:title
Thick Printed Copper Conductors on Alumina substrates Thick Printed Copper Conductors on Alumina substrates
skos:prefLabel
Thick Printed Copper Conductors on Alumina substrates Thick Printed Copper Conductors on Alumina substrates
skos:notation
RIV/49777513:23220/14:43922441!RIV15-MSM-23220___
n3:aktivita
n13:P
n3:aktivity
P(ED2.1.00/03.0094), P(LF14029)
n3:dodaniDat
n6:2015
n3:domaciTvurceVysledku
n7:2069199 n7:2203316 n7:4025814
n3:druhVysledku
n9:D
n3:duvernostUdaju
n20:S
n3:entitaPredkladatele
n5:predkladatel
n3:idSjednocenehoVysledku
50426
n3:idVysledku
RIV/49777513:23220/14:43922441
n3:jazykVysledku
n8:eng
n3:klicovaSlova
thick films; thermal conductivity; copper; alumina
n3:klicoveSlovo
n16:alumina n16:thermal%20conductivity n16:copper n16:thick%20films
n3:kontrolniKodProRIV
[DF112E3CAD45]
n3:mistoKonaniAkce
Drážďany, Německo
n3:mistoVydani
Piscataway
n3:nazevZdroje
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology (ISSE 2014)
n3:obor
n12:JB
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
3
n3:projekt
n17:ED2.1.00%2F03.0094 n17:LF14029
n3:rokUplatneniVysledku
n6:2014
n3:tvurceVysledku
Řeboun, Jan Štulík, Jiří Hromadka, Karel
n3:typAkce
n23:WRD
n3:zahajeniAkce
2014-05-07+02:00
s:issn
2161-2528
s:numberOfPages
4
n19:doi
10.1109/ISSE.2014.6887570
n10:hasPublisher
IEEE
n15:isbn
978-1-4799-4455-2
n18:organizacniJednotka
23220