This HTML5 document contains 50 embedded RDF statements represented using HTML+Microdata notation.

The embedded RDF content will be recognized by any processor of HTML5 Microdata.

Namespace Prefixes

PrefixIRI
n5http://linked.opendata.cz/ontology/domain/vavai/riv/typAkce/
dctermshttp://purl.org/dc/terms/
n22http://localhost/temp/predkladatel/
n19http://purl.org/net/nknouf/ns/bibtex#
n15http://linked.opendata.cz/resource/domain/vavai/projekt/
n9http://linked.opendata.cz/resource/domain/vavai/riv/tvurce/
n20http://linked.opendata.cz/ontology/domain/vavai/
shttp://schema.org/
skoshttp://www.w3.org/2004/02/skos/core#
rdfshttp://www.w3.org/2000/01/rdf-schema#
n3http://linked.opendata.cz/ontology/domain/vavai/riv/
n12http://bibframe.org/vocab/
n2http://linked.opendata.cz/resource/domain/vavai/vysledek/
rdfhttp://www.w3.org/1999/02/22-rdf-syntax-ns#
n7http://linked.opendata.cz/ontology/domain/vavai/riv/klicoveSlovo/
n16http://linked.opendata.cz/ontology/domain/vavai/riv/duvernostUdaju/
xsdhhttp://www.w3.org/2001/XMLSchema#
n13http://linked.opendata.cz/ontology/domain/vavai/riv/aktivita/
n8http://linked.opendata.cz/ontology/domain/vavai/riv/jazykVysledku/
n18http://linked.opendata.cz/ontology/domain/vavai/riv/obor/
n11http://linked.opendata.cz/ontology/domain/vavai/riv/druhVysledku/
n21http://linked.opendata.cz/resource/domain/vavai/vysledek/RIV%2F49777513%3A23220%2F14%3A43922435%21RIV15-MSM-23220___/
n14http://reference.data.gov.uk/id/gregorian-year/

Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F14%3A43922435%21RIV15-MSM-23220___
rdf:type
skos:Concept n20:Vysledek
rdfs:seeAlso
http://www.sciencedirect.com/science/article/pii/S1877705814003531
dcterms:description
This paper deals with a method for low cost power electronic substrates creation, which are used for power electronic devices. Direct bond copper (DBC) technology is suitable for creating substrates with excellent thermal and electrical conductivity and good mechanical properties. Furthermore, DBC allows to create copper layers with the thickness of hundreds micrometers in one processing step. In this work, the muffle furnace is used for bonding copper to ceramic. Temperature profile, oxygen concentration during the bonding process and final treatment is described. The last part summarizes the results and presents advantages of this method. This paper deals with a method for low cost power electronic substrates creation, which are used for power electronic devices. Direct bond copper (DBC) technology is suitable for creating substrates with excellent thermal and electrical conductivity and good mechanical properties. Furthermore, DBC allows to create copper layers with the thickness of hundreds micrometers in one processing step. In this work, the muffle furnace is used for bonding copper to ceramic. Temperature profile, oxygen concentration during the bonding process and final treatment is described. The last part summarizes the results and presents advantages of this method.
dcterms:title
DBC Technology for low cost power electronic substrate manufacturing DBC Technology for low cost power electronic substrate manufacturing
skos:prefLabel
DBC Technology for low cost power electronic substrate manufacturing DBC Technology for low cost power electronic substrate manufacturing
skos:notation
RIV/49777513:23220/14:43922435!RIV15-MSM-23220___
n3:aktivita
n13:P n13:I
n3:aktivity
I, P(ED2.1.00/03.0094)
n3:dodaniDat
n14:2015
n3:domaciTvurceVysledku
n9:1409573 n9:2203316 n9:4025814 n9:2069199
n3:druhVysledku
n11:D
n3:duvernostUdaju
n16:S
n3:entitaPredkladatele
n21:predkladatel
n3:idSjednocenehoVysledku
9866
n3:idVysledku
RIV/49777513:23220/14:43922435
n3:jazykVysledku
n8:eng
n3:klicovaSlova
DBC; thick film copper; alumina; Ceramic substrate
n3:klicoveSlovo
n7:DBC n7:thick%20film%20copper n7:Ceramic%20substrate n7:alumina
n3:kontrolniKodProRIV
[6B0B1793723D]
n3:mistoKonaniAkce
Zadar, Chorvatsko
n3:mistoVydani
Vienna
n3:nazevZdroje
Procedia Engineering
n3:obor
n18:JA
n3:pocetDomacichTvurcuVysledku
4
n3:pocetTvurcuVysledku
4
n3:projekt
n15:ED2.1.00%2F03.0094
n3:rokUplatneniVysledku
n14:2014
n3:tvurceVysledku
Řeboun, Jan Hromadka, Karel Štulík, Jiří Hamáček, Aleš
n3:typAkce
n5:WRD
n3:wos
000335859300156
n3:zahajeniAkce
2013-10-23+02:00
s:issn
1877-7058
s:numberOfPages
4
n12:doi
10.1016/j.proeng.2014.03.107
n19:hasPublisher
Elsevier
n22:organizacniJednotka
23220