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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F13%3A43919752%21RIV14-MSM-23220___
rdf:type
n7:Vysledek skos:Concept
dcterms:description
This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the peak temperature and the duration of peak time. The peak temperature has two levels, 235 and 250°C. The time of peak temperature has two levels, 20 and 50s. The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the peak temperature and the duration of peak time. The peak temperature has two levels, 235 and 250°C. The time of peak temperature has two levels, 20 and 50s. The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the peak temperature and the duration of peak time. The peak temperature has two levels, 235 and 250°C. The time of peak temperature has two levels, 20 and 50s. The IMC thickness increases with higher reflow peak temperature and longer time above liquidus.
dcterms:title
Vliv pájecího profilu na mechanickou pevnost pájeného spoje Vliv pájecího profilu na mechanickou pevnost pájeného spoje Influence of Reflow Profile to Solder Joint Mechanical Strength
skos:prefLabel
Vliv pájecího profilu na mechanickou pevnost pájeného spoje Vliv pájecího profilu na mechanickou pevnost pájeného spoje Influence of Reflow Profile to Solder Joint Mechanical Strength
skos:notation
RIV/49777513:23220/13:43919752!RIV14-MSM-23220___
n7:predkladatel
n8:orjk%3A23220
n4:aktivita
n17:S
n4:aktivity
S
n4:dodaniDat
n11:2014
n4:domaciTvurceVysledku
n5:5061334
n4:druhVysledku
n9:O
n4:duvernostUdaju
n14:S
n4:entitaPredkladatele
n13:predkladatel
n4:idSjednocenehoVysledku
114572
n4:idVysledku
RIV/49777513:23220/13:43919752
n4:jazykVysledku
n6:cze
n4:klicovaSlova
Intermetallic compound; Soldering; Reflow profile
n4:klicoveSlovo
n15:Soldering n15:Reflow%20profile n15:Intermetallic%20compound
n4:kontrolniKodProRIV
[DFAD1ED8C55F]
n4:obor
n16:JA
n4:pocetDomacichTvurcuVysledku
1
n4:pocetTvurcuVysledku
1
n4:rokUplatneniVysledku
n11:2013
n4:tvurceVysledku
Wirth, Václav
n3:organizacniJednotka
23220