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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F13%3A43919730%21RIV14-MSM-23220___
rdf:type
skos:Concept n14:Vysledek
dcterms:description
This paper deals with contamination of PCB after soldering process. First part presents the ionic contamination and the experiment. For measuring of contamination the contaminometer CM11 was chosen. Three No-clean solder pastes were used for testing. The tested samples were made of PCB where the solder pastes were applied. The tested samples were soldered with different solder profiles. After the soldering process ionic contamination was measured and evaluated. The obtained results were discussed. This paper deals with contamination of PCB after soldering process. First part presents the ionic contamination and the experiment. For measuring of contamination the contaminometer CM11 was chosen. Three No-clean solder pastes were used for testing. The tested samples were made of PCB where the solder pastes were applied. The tested samples were soldered with different solder profiles. After the soldering process ionic contamination was measured and evaluated. The obtained results were discussed. This paper deals with contamination of PCB after soldering process. First part presents the ionic contamination and the experiment. For measuring of contamination the contaminometer CM11 was chosen. Three No-clean solder pastes were used for testing. The tested samples were made of PCB where the solder pastes were applied. The tested samples were soldered with different solder profiles. After the soldering process ionic contamination was measured and evaluated. The obtained results were discussed.
dcterms:title
Kontaminace DPS po pájecím procesu s %22NO-Clean%22 pájecími pastami Kontaminace DPS po pájecím procesu s %22NO-Clean%22 pájecími pastami Contamination of PCB after the soldering process with ?NO-clean? solder pastes
skos:prefLabel
Kontaminace DPS po pájecím procesu s %22NO-Clean%22 pájecími pastami Kontaminace DPS po pájecím procesu s %22NO-Clean%22 pájecími pastami Contamination of PCB after the soldering process with ?NO-clean? solder pastes
skos:notation
RIV/49777513:23220/13:43919730!RIV14-MSM-23220___
n14:predkladatel
n15:orjk%3A23220
n3:aktivita
n5:S
n3:aktivity
S
n3:dodaniDat
n12:2014
n3:domaciTvurceVysledku
n9:1643703
n3:druhVysledku
n16:O
n3:duvernostUdaju
n13:S
n3:entitaPredkladatele
n8:predkladatel
n3:idSjednocenehoVysledku
83362
n3:idVysledku
RIV/49777513:23220/13:43919730
n3:jazykVysledku
n4:cze
n3:klicovaSlova
flux, soldering
n3:klicoveSlovo
n7:flux n7:soldering
n3:kontrolniKodProRIV
[7302104B925D]
n3:obor
n10:JA
n3:pocetDomacichTvurcuVysledku
1
n3:pocetTvurcuVysledku
1
n3:rokUplatneniVysledku
n12:2013
n3:tvurceVysledku
Rendl, Karel
n17:organizacniJednotka
23220