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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F12%3A43925000%21RIV15-MSM-23220___
rdf:type
skos:Concept n20:Vysledek
dcterms:description
This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150°C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for research of IMCs growth influence on strength of soldered joints. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes and the results of shear strength measurement will be presented in this article. This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150°C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for research of IMCs growth influence on strength of soldered joints. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes and the results of shear strength measurement will be presented in this article.
dcterms:title
Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints
skos:prefLabel
Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints
skos:notation
RIV/49777513:23220/12:43925000!RIV15-MSM-23220___
n3:aktivita
n16:P
n3:aktivity
P(ED2.1.00/03.0094)
n3:dodaniDat
n12:2015
n3:domaciTvurceVysledku
n11:7305257 n11:3434117
n3:druhVysledku
n19:D
n3:duvernostUdaju
n14:S
n3:entitaPredkladatele
n13:predkladatel
n3:idSjednocenehoVysledku
141457
n3:idVysledku
RIV/49777513:23220/12:43925000
n3:jazykVysledku
n21:eng
n3:klicovaSlova
thermal stress; lead-free solder joint, shear test; Intermetallic compound
n3:klicoveSlovo
n4:thermal%20stress n4:shear%20test n4:Intermetallic%20compound n4:lead-free%20solder%20joint
n3:kontrolniKodProRIV
[B3B97200C6B1]
n3:mistoKonaniAkce
Bad Aussee, Austria
n3:mistoVydani
Vienna
n3:nazevZdroje
35 th International Spring Seminar on Electronics Technology - Power Electronics
n3:obor
n7:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:projekt
n18:ED2.1.00%2F03.0094
n3:rokUplatneniVysledku
n12:2012
n3:tvurceVysledku
Steiner, František Novák, Tomáš
n3:typAkce
n17:WRD
n3:zahajeniAkce
2012-05-09+02:00
s:issn
2161-2528
s:numberOfPages
5
n6:doi
10.1109/ISSE.2012.6273075
n8:hasPublisher
Vienna University of Technology, Austria
n22:isbn
978-1-4673-2240-9
n5:organizacniJednotka
23220