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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F10%3A00504874%21RIV11-MSM-23220___
rdf:type
n8:Vysledek skos:Concept
dcterms:description
This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere an This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere an
dcterms:title
Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC
skos:prefLabel
Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC
skos:notation
RIV/49777513:23220/10:00504874!RIV11-MSM-23220___
n3:aktivita
n17:Z n17:S
n3:aktivity
S, Z(MSM4977751310)
n3:cisloPeriodika
3
n3:dodaniDat
n7:2011
n3:domaciTvurceVysledku
n18:3434117 n18:7305257
n3:druhVysledku
n10:J
n3:duvernostUdaju
n16:S
n3:entitaPredkladatele
n5:predkladatel
n3:idSjednocenehoVysledku
256220
n3:idVysledku
RIV/49777513:23220/10:00504874
n3:jazykVysledku
n9:eng
n3:klicovaSlova
Intermetallic compounds; lead-free solder; copper substrate; thermal aging
n3:klicoveSlovo
n4:copper%20substrate n4:thermal%20aging n4:Intermetallic%20compounds n4:lead-free%20solder
n3:kodStatuVydavatele
CZ - Česká republika
n3:kontrolniKodProRIV
[9EF710C3F423]
n3:nazevZdroje
Electroscope
n3:obor
n13:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n7:2010
n3:svazekPeriodika
2010
n3:tvurceVysledku
Steiner, František Novák, Tomáš
n3:zamer
n14:MSM4977751310
s:issn
1802-4564
s:numberOfPages
5
n12:organizacniJednotka
23220