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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F09%3A00501678%21RIV10-MSM-23220___
rdf:type
n15:Vysledek skos:Concept
dcterms:description
The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. Differences were in levels of roughness and orientation of scratches. This comparison will be made for testing samples of printed circuit boards with surface pure copper (Cu). The test samples were purposely roughened by different abrasive paper before solderability testing. Roughness made on surface finishes was oriented vertically and horizontally. These orientations are relative to attachment tested sample in tester. The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. Differences were in levels of roughness and orientation of scratches. This comparison will be made for testing samples of printed circuit boards with surface pure copper (Cu). The test samples were purposely roughened by different abrasive paper before solderability testing. Roughness made on surface finishes was oriented vertically and horizontally. These orientations are relative to attachment tested sample in tester.
dcterms:title
Solderability Dependence on Surface Roughness Solderability Dependence on Surface Roughness
skos:prefLabel
Solderability Dependence on Surface Roughness Solderability Dependence on Surface Roughness
skos:notation
RIV/49777513:23220/09:00501678!RIV10-MSM-23220___
n3:aktivita
n18:Z
n3:aktivity
Z(MSM4977751310)
n3:dodaniDat
n6:2010
n3:domaciTvurceVysledku
n10:7305257 n10:3434117
n3:druhVysledku
n14:D
n3:duvernostUdaju
n19:S
n3:entitaPredkladatele
n13:predkladatel
n3:idSjednocenehoVysledku
342259
n3:idVysledku
RIV/49777513:23220/09:00501678
n3:jazykVysledku
n5:eng
n3:klicovaSlova
Surface roughness; solderability; wetting force; wetting balance test
n3:klicoveSlovo
n4:wetting%20balance%20test n4:Surface%20roughness n4:solderability n4:wetting%20force
n3:kontrolniKodProRIV
[D9FE9D457F85]
n3:mistoKonaniAkce
Brno
n3:mistoVydani
Brno
n3:nazevZdroje
EDS '09 IMAPS CS international conference proceedings
n3:obor
n21:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
4
n3:rokUplatneniVysledku
n6:2009
n3:tvurceVysledku
Starý, Jiří Novák, Tomáš Stejskal, Petr Steiner, František
n3:typAkce
n12:WRD
n3:zahajeniAkce
2009-09-03+02:00
n3:zamer
n20:MSM4977751310
s:numberOfPages
6
n7:hasPublisher
Vysoké učení technické v Brně
n11:isbn
978-80-214-3933-7
n16:organizacniJednotka
23220