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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F09%3A00501574%21RIV10-MSM-23220___
rdf:type
n11:Vysledek skos:Concept
dcterms:description
The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. This comparison will be made for several surface finish types. Test specimens of printed circuit boards with surface finishes SnG (galvanic tin), SnC (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) were tested. The test specimens were purposely roughened by different abrasive paper before solderability testing. Roughness created on surface finishes were oriented vertically and horizontally. The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. This comparison will be made for several surface finish types. Test specimens of printed circuit boards with surface finishes SnG (galvanic tin), SnC (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) were tested. The test specimens were purposely roughened by different abrasive paper before solderability testing. Roughness created on surface finishes were oriented vertically and horizontally.
dcterms:title
Surface Roughness Influence on Solderability Surface Roughness Influence on Solderability
skos:prefLabel
Surface Roughness Influence on Solderability Surface Roughness Influence on Solderability
skos:notation
RIV/49777513:23220/09:00501574!RIV10-MSM-23220___
n3:aktivita
n15:Z
n3:aktivity
Z(MSM4977751310)
n3:dodaniDat
n8:2010
n3:domaciTvurceVysledku
n4:3434117 n4:7305257
n3:druhVysledku
n6:D
n3:duvernostUdaju
n16:S
n3:entitaPredkladatele
n12:predkladatel
n3:idSjednocenehoVysledku
344792
n3:idVysledku
RIV/49777513:23220/09:00501574
n3:jazykVysledku
n10:eng
n3:klicovaSlova
Surface roughness; solderability; wetting force; wetting balance test.
n3:klicoveSlovo
n9:wetting%20force n9:solderability n9:Surface%20roughness n9:wetting%20balance%20test.
n3:kontrolniKodProRIV
[D80788596EF8]
n3:mistoKonaniAkce
Brno
n3:mistoVydani
Piscataway
n3:nazevZdroje
International Spring Seminar on Electronics Technology
n3:obor
n20:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n8:2009
n3:tvurceVysledku
Novák, Tomáš Steiner, František
n3:typAkce
n17:WRD
n3:zahajeniAkce
2009-05-17+02:00
n3:zamer
n14:MSM4977751310
s:numberOfPages
6
n13:hasPublisher
IEEE
n21:isbn
978-1-4244-4260-7
n18:organizacniJednotka
23220