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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F08%3A00500315%21RIV11-MSM-23220___
rdf:type
n15:Vysledek skos:Concept
dcterms:description
Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). For measurement was used one of the solderability evaluation methods known as the wetting balance test. The wetting balance test measures the wetting forces imposed by the molten solder on the test surface as it is dipped into and held in the solder bath as a function of time. Paper will present the comparison of results of printed circuit board solderability test with preheating in agreement with IPC/EIA J-STD-003A, with IEC 60068-2-54 and with hot air double-sided preheating. This comparison will be also made for several lead-free surface finish types. It was tested printed circuit board coupons with surface finishing of galvanic tin, immersion tin, ENIG (electroless nickel immersion gold), OSP (organic solderability preservative) and pure copper. Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). For measurement was used one of the solderability evaluation methods known as the wetting balance test. The wetting balance test measures the wetting forces imposed by the molten solder on the test surface as it is dipped into and held in the solder bath as a function of time. Paper will present the comparison of results of printed circuit board solderability test with preheating in agreement with IPC/EIA J-STD-003A, with IEC 60068-2-54 and with hot air double-sided preheating. This comparison will be also made for several lead-free surface finish types. It was tested printed circuit board coupons with surface finishing of galvanic tin, immersion tin, ENIG (electroless nickel immersion gold), OSP (organic solderability preservative) and pure copper.
dcterms:title
Double-sided Preheating Influence on Solderability Double-sided Preheating Influence on Solderability
skos:prefLabel
Double-sided Preheating Influence on Solderability Double-sided Preheating Influence on Solderability
skos:notation
RIV/49777513:23220/08:00500315!RIV11-MSM-23220___
n3:aktivita
n14:Z
n3:aktivity
Z(MSM4977751310)
n3:dodaniDat
n9:2011
n3:domaciTvurceVysledku
n10:7305257 n10:8804419
n3:druhVysledku
n4:D
n3:duvernostUdaju
n13:S
n3:entitaPredkladatele
n20:predkladatel
n3:idSjednocenehoVysledku
364359
n3:idVysledku
RIV/49777513:23220/08:00500315
n3:jazykVysledku
n21:eng
n3:klicovaSlova
Wetting balance test; preheating; solderability; wetting force
n3:klicoveSlovo
n8:wetting%20force n8:solderability n8:preheating n8:Wetting%20balance%20test
n3:kontrolniKodProRIV
[685929BDEF9B]
n3:mistoKonaniAkce
Budapešť
n3:mistoVydani
New York
n3:nazevZdroje
ISSE 2008
n3:obor
n16:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n9:2008
n3:tvurceVysledku
Harant, Petr Steiner, František
n3:typAkce
n11:WRD
n3:wos
000272337900079
n3:zahajeniAkce
2008-01-01+01:00
n3:zamer
n6:MSM4977751310
s:numberOfPages
6
n17:hasPublisher
IEEE
n5:isbn
978-1-4244-3973-7
n12:organizacniJednotka
23220