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Statements

Subject Item
n2:RIV%2F49777513%3A23220%2F07%3A00000020%21RIV08-MSM-23220___
rdf:type
n12:Vysledek skos:Concept
dcterms:description
Příspěvek pojednává o výsledcích testování pájitelnosti desek plošných spojů. Testované vzorky byly očištěny směsí glykoleterů, které jsou jednou z nových metod čištění zlepšující pájitelnost. Dále je prezentováno srovnání pájitelnosti desek čištěných a nečištěných. Toto srovnání bylo provedeno pro různé povrchové úpravy. Paper deals with results of solderability testing of printed circuit boards. Tested specimens were cleaned by the mixture of glycoleters, which is one of new cleaning methods. Paper will present the comparison of solderability results of both cleaned and non cleaned printed circuit boards. This comparison will be also made for several surface finish types. Printed circuit board coupons with surface finishing of galvanic tin, immersion tin, pure copper, OSP and ENIG were tested. Paper deals with results of solderability testing of printed circuit boards. Tested specimens were cleaned by the mixture of glycoleters, which is one of new cleaning methods. Paper will present the comparison of solderability results of both cleaned and non cleaned printed circuit boards. This comparison will be also made for several surface finish types. Printed circuit board coupons with surface finishing of galvanic tin, immersion tin, pure copper, OSP and ENIG were tested.
dcterms:title
Cleaning Impact on Printed Circuit Board Solderability Cleaning Impact on Printed Circuit Board Solderability Vliv čištění na pájitelnost desek plošných spojů
skos:prefLabel
Cleaning Impact on Printed Circuit Board Solderability Cleaning Impact on Printed Circuit Board Solderability Vliv čištění na pájitelnost desek plošných spojů
skos:notation
RIV/49777513:23220/07:00000020!RIV08-MSM-23220___
n3:strany
271-275
n3:aktivita
n15:Z
n3:aktivity
Z(MSM4977751310)
n3:dodaniDat
n8:2008
n3:domaciTvurceVysledku
n14:8804419 n14:7305257
n3:druhVysledku
n6:D
n3:duvernostUdaju
n16:S
n3:entitaPredkladatele
n18:predkladatel
n3:idSjednocenehoVysledku
413881
n3:idVysledku
RIV/49777513:23220/07:00000020
n3:jazykVysledku
n5:eng
n3:klicovaSlova
solderability testing; wetting; cleaning; lead free surface finish
n3:klicoveSlovo
n4:lead%20free%20surface%20finish n4:cleaning n4:solderability%20testing n4:wetting
n3:kontrolniKodProRIV
[ED1B88B61B0C]
n3:mistoKonaniAkce
Brno
n3:mistoVydani
Brno
n3:nazevZdroje
Electronic Devices and Systems
n3:obor
n11:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n8:2007
n3:tvurceVysledku
Steiner, František Harant, Petr
n3:typAkce
n20:WRD
n3:zahajeniAkce
2007-01-01+01:00
n3:zamer
n13:MSM4977751310
s:numberOfPages
5
n9:hasPublisher
Vysoké učení technické v Brně
n17:isbn
978-80-214-3470-7
n19:organizacniJednotka
23220