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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F14%3APU109465%21RIV15-MSM-26220___
rdf:type
skos:Concept n19:Vysledek
dcterms:description
Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns verifies bonding qu Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns verifies bonding qu
dcterms:title
Bonding of LTCC with Alumina ceramics Bonding of LTCC with Alumina ceramics
skos:prefLabel
Bonding of LTCC with Alumina ceramics Bonding of LTCC with Alumina ceramics
skos:notation
RIV/00216305:26220/14:PU109465!RIV15-MSM-26220___
n4:aktivita
n20:S
n4:aktivity
S
n4:dodaniDat
n5:2015
n4:domaciTvurceVysledku
n7:5539269 n7:2316161 n7:7567375 n7:5896126
n4:druhVysledku
n15:D
n4:duvernostUdaju
n8:S
n4:entitaPredkladatele
n18:predkladatel
n4:idSjednocenehoVysledku
5676
n4:idVysledku
RIV/00216305:26220/14:PU109465
n4:jazykVysledku
n14:eng
n4:klicovaSlova
Alumina Ceramics, Bonding, LTCC, Cold Chemical Lamination
n4:klicoveSlovo
n9:Cold%20Chemical%20Lamination n9:Alumina%20Ceramics n9:Bonding n9:LTCC
n4:kontrolniKodProRIV
[241D9E9A2699]
n4:mistoKonaniAkce
Brno
n4:mistoVydani
Brno
n4:nazevZdroje
Electronic Devices and Systems, IMAPS CS International Conference 2014
n4:obor
n13:JA
n4:pocetDomacichTvurcuVysledku
4
n4:pocetTvurcuVysledku
4
n4:rokUplatneniVysledku
n5:2014
n4:tvurceVysledku
Šandera, Josef Szendiuch, Ivan Somer, Jakub Štekovič, Michal
n4:typAkce
n12:WRD
n4:zahajeniAkce
2014-06-25+02:00
s:numberOfPages
149
n11:hasPublisher
Vysoké učení technické v Brně
n17:isbn
978-80-214-4985-5
n16:organizacniJednotka
26220