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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F14%3APU106539%21RIV15-MSM-26220___
rdf:type
skos:Concept n16:Vysledek
dcterms:description
Ceramics joints are applied for producing products that should be made in a general shapes and dimensions for more advantageous usage. The article presents the research work related to ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in the electronics industry and motivation for joining ceramics is described in the introduction. The requirements and methods for improving the quality of joints are summarized. also, the results of simulations of pressure sensor cooling after removal from the oven during joining are discussed. The experimental results are evaluated by using a t-test before and after process cooling modification. Important directions for future research are summarized, with emphasis on the statistical determination of poor connection, and how the interface of modification of joint technology and process setting affects results and parameters that have been achieved. Ceramics joints are applied for producing products that should be made in a general shapes and dimensions for more advantageous usage. The article presents the research work related to ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in the electronics industry and motivation for joining ceramics is described in the introduction. The requirements and methods for improving the quality of joints are summarized. also, the results of simulations of pressure sensor cooling after removal from the oven during joining are discussed. The experimental results are evaluated by using a t-test before and after process cooling modification. Important directions for future research are summarized, with emphasis on the statistical determination of poor connection, and how the interface of modification of joint technology and process setting affects results and parameters that have been achieved.
dcterms:title
Optimization of ceramics bonding in the area of pressure sensor manufacturing Optimization of ceramics bonding in the area of pressure sensor manufacturing
skos:prefLabel
Optimization of ceramics bonding in the area of pressure sensor manufacturing Optimization of ceramics bonding in the area of pressure sensor manufacturing
skos:notation
RIV/00216305:26220/14:PU106539!RIV15-MSM-26220___
n3:aktivita
n4:S n4:P
n3:aktivity
P(ED1.1.00/02.0068), P(FR-TI3/017), S
n3:cisloPeriodika
4-5
n3:dodaniDat
n8:2015
n3:domaciTvurceVysledku
n11:6737064 n11:9065148 n11:5895693 n11:1421271
n3:druhVysledku
n6:J
n3:duvernostUdaju
n9:S
n3:entitaPredkladatele
n17:predkladatel
n3:idSjednocenehoVysledku
34943
n3:idVysledku
RIV/00216305:26220/14:PU106539
n3:jazykVysledku
n15:eng
n3:klicovaSlova
ceramic, bonding, pressure, sensor, joint, technology
n3:klicoveSlovo
n5:ceramic n5:bonding n5:technology n5:pressure n5:joint n5:sensor
n3:kodStatuVydavatele
DE - Spolková republika Německo
n3:kontrolniKodProRIV
[EF84878F16AA]
n3:nazevZdroje
Microsystem Technologies
n3:obor
n10:JB
n3:pocetDomacichTvurcuVysledku
4
n3:pocetTvurcuVysledku
4
n3:projekt
n13:ED1.1.00%2F02.0068 n13:FR-TI3%2F017
n3:rokUplatneniVysledku
n8:2014
n3:svazekPeriodika
20
n3:tvurceVysledku
Novotný, Radovan Kuchta, Radek Kadlec, Jaroslav Vlach, Radek
s:issn
0946-7076
s:numberOfPages
10
n19:doi
10.1007/s00542-013-2013-7
n14:organizacniJednotka
26220