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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F13%3APU105873%21RIV14-MSM-26220___
rdf:type
n8:Vysledek skos:Concept
dcterms:description
The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts. The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.
dcterms:title
Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate
skos:prefLabel
Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate
skos:notation
RIV/00216305:26220/13:PU105873!RIV14-MSM-26220___
n8:predkladatel
n12:orjk%3A26220
n3:aktivita
n11:S
n3:aktivity
S
n3:cisloPeriodika
2013
n3:dodaniDat
n5:2014
n3:domaciTvurceVysledku
n6:7567375 n6:8549176 n6:4957296
n3:druhVysledku
n15:J
n3:duvernostUdaju
n9:S
n3:entitaPredkladatele
n19:predkladatel
n3:idSjednocenehoVysledku
66391
n3:idVysledku
RIV/00216305:26220/13:PU105873
n3:jazykVysledku
n14:eng
n3:klicovaSlova
LTCC, THT, device, joint, reliability.
n3:klicoveSlovo
n7:LTCC n7:reliability. n7:joint n7:device n7:THT
n3:kodStatuVydavatele
SK - Slovenská republika
n3:kontrolniKodProRIV
[D0B171108AF1]
n3:nazevZdroje
Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics
n3:obor
n4:JA
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
3
n3:rokUplatneniVysledku
n5:2013
n3:svazekPeriodika
36
n3:tvurceVysledku
Psota, Boleslav Klíma, Martin Szendiuch, Ivan
s:issn
2161-2528
s:numberOfPages
5
n16:doi
10.1109/ISSE.2013.6648228
n18:organizacniJednotka
26220