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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F13%3APU104574%21RIV15-MSM-26220___
rdf:type
skos:Concept n21:Vysledek
dcterms:description
This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper. This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper.
dcterms:title
Board on Board New PCB Configuration Moving in 3D Packaging Board on Board New PCB Configuration Moving in 3D Packaging
skos:prefLabel
Board on Board New PCB Configuration Moving in 3D Packaging Board on Board New PCB Configuration Moving in 3D Packaging
skos:notation
RIV/00216305:26220/13:PU104574!RIV15-MSM-26220___
n3:aktivita
n5:S n5:P
n3:aktivity
P(LF13007), S
n3:dodaniDat
n10:2015
n3:domaciTvurceVysledku
n6:9466509 n6:4957296 n6:4205421
n3:druhVysledku
n17:D
n3:duvernostUdaju
n11:S
n3:entitaPredkladatele
n19:predkladatel
n3:idSjednocenehoVysledku
63660
n3:idVysledku
RIV/00216305:26220/13:PU104574
n3:jazykVysledku
n20:eng
n3:klicovaSlova
PCB, 3D packaging, reliability, vibration testing, ANSYS
n3:klicoveSlovo
n7:PCB n7:reliability n7:ANSYS n7:3D%20packaging n7:vibration%20testing
n3:kontrolniKodProRIV
[83BD2CAB988F]
n3:mistoKonaniAkce
Brno
n3:mistoVydani
Vysoké učení technické v Brně
n3:nazevZdroje
THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013
n3:obor
n12:JA
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
4
n3:projekt
n13:LF13007
n3:rokUplatneniVysledku
n10:2013
n3:tvurceVysledku
Psota, Boleslav Szendiuch, Ivan Otáhal, Alexandr Hejátková, Edita
n3:typAkce
n8:WRD
n3:zahajeniAkce
2013-06-26+02:00
s:numberOfPages
4
n16:hasPublisher
Novapress sro
n15:isbn
978-80-214-4754-7
n18:organizacniJednotka
26220