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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F13%3APU103648%21RIV14-MSM-26220___
rdf:type
n8:Vysledek skos:Concept
dcterms:description
This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software. This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software.
dcterms:title
Wire-Bonds Durability in High-Temperature Applications Wire-Bonds Durability in High-Temperature Applications
skos:prefLabel
Wire-Bonds Durability in High-Temperature Applications Wire-Bonds Durability in High-Temperature Applications
skos:notation
RIV/00216305:26220/13:PU103648!RIV14-MSM-26220___
n8:predkladatel
n9:orjk%3A26220
n4:aktivita
n21:S
n4:aktivity
S
n4:dodaniDat
n5:2014
n4:domaciTvurceVysledku
n14:8549176 n14:7567375 n14:4957296
n4:druhVysledku
n16:D
n4:duvernostUdaju
n7:S
n4:entitaPredkladatele
n12:predkladatel
n4:idSjednocenehoVysledku
117407
n4:idVysledku
RIV/00216305:26220/13:PU103648
n4:jazykVysledku
n15:eng
n4:klicovaSlova
wire-bond, wire-bonding, gold, LTCC, low-temperature co-fired ceramic
n4:klicoveSlovo
n6:LTCC n6:low-temperature%20co-fired%20ceramic n6:wire-bond n6:wire-bonding n6:gold
n4:kontrolniKodProRIV
[4542346EBE38]
n4:mistoKonaniAkce
Brno
n4:mistoVydani
Brno
n4:nazevZdroje
Electronic Devices and Systems - IMAPS CS International Conference 2013
n4:obor
n11:JA
n4:pocetDomacichTvurcuVysledku
3
n4:pocetTvurcuVysledku
3
n4:rokUplatneniVysledku
n5:2013
n4:tvurceVysledku
Klíma, Martin Psota, Boleslav Szendiuch, Ivan
n4:typAkce
n18:WRD
n4:zahajeniAkce
2013-06-26+02:00
s:numberOfPages
6
n3:hasPublisher
Vysoké učení technické v Brně
n19:isbn
978-80-214-4754-7
n20:organizacniJednotka
26220