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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F12%3APU101080%21RIV13-MSM-26220___
rdf:type
n4:Vysledek skos:Concept
dcterms:description
Reflow process is an important part of the microelectronics manufacturing. Still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering into new areas. There is a space for new material compositions which do not contain lead, new procedure process, device setting, and began to make greater use of protective atmosphere. This article is focus on nitrogen protective atmosphere. Soldering was made on alumina substrate with conductive motive created by silver paste without surface finish. Solder paste SAC305, Sn100C, SnAgCuBiIn was used and paste SnPbAg as reference. A measurement of wetting and visual inspection according IPC-610 was used to evaluate the influence of nitrogen atmosphere. Comparison between alumina and FR-4 with NiAu surface finish is shown at the end of paper. Reflow process is an important part of the microelectronics manufacturing. Still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering into new areas. There is a space for new material compositions which do not contain lead, new procedure process, device setting, and began to make greater use of protective atmosphere. This article is focus on nitrogen protective atmosphere. Soldering was made on alumina substrate with conductive motive created by silver paste without surface finish. Solder paste SAC305, Sn100C, SnAgCuBiIn was used and paste SnPbAg as reference. A measurement of wetting and visual inspection according IPC-610 was used to evaluate the influence of nitrogen atmosphere. Comparison between alumina and FR-4 with NiAu surface finish is shown at the end of paper.
dcterms:title
EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS
skos:prefLabel
EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS
skos:notation
RIV/00216305:26220/12:PU101080!RIV13-MSM-26220___
n4:predkladatel
n12:orjk%3A26220
n3:aktivita
n8:S
n3:aktivity
S
n3:dodaniDat
n14:2013
n3:domaciTvurceVysledku
n5:8624658 n5:7785917 n5:7567375
n3:druhVysledku
n13:D
n3:duvernostUdaju
n21:S
n3:entitaPredkladatele
n19:predkladatel
n3:idSjednocenehoVysledku
133171
n3:idVysledku
RIV/00216305:26220/12:PU101080
n3:jazykVysledku
n15:eng
n3:klicovaSlova
Nitrogen, atmosphere, alumina, lead-free solder
n3:klicoveSlovo
n6:lead-free%20solder n6:alumina n6:atmosphere n6:Nitrogen
n3:kontrolniKodProRIV
[652EBFF3FF02]
n3:mistoKonaniAkce
Brno
n3:mistoVydani
Brno
n3:nazevZdroje
EDS 12 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS
n3:obor
n7:JA
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
3
n3:rokUplatneniVysledku
n14:2012
n3:tvurceVysledku
Adámek, Martin Szendiuch, Ivan Schnederle, Petr
n3:typAkce
n16:WRD
n3:zahajeniAkce
2012-06-28+02:00
s:numberOfPages
6
n17:hasPublisher
Ing. Vladislav Pokorný - LITERA, Tábor 43a, 612 00 Brno
n11:isbn
978-80-214-4539-0
n20:organizacniJednotka
26220