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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F12%3APU101021%21RIV13-MPO-26220___
rdf:type
skos:Concept n6:Vysledek
rdfs:seeAlso
http://www.estc2012.eu
dcterms:description
Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength. Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength.
dcterms:title
The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates
skos:prefLabel
The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates
skos:notation
RIV/00216305:26220/12:PU101021!RIV13-MPO-26220___
n6:predkladatel
n15:orjk%3A26220
n4:aktivita
n16:S n16:P
n4:aktivity
P(2A-1TP1/143), S
n4:dodaniDat
n9:2013
n4:domaciTvurceVysledku
n5:7785917 n5:8624658 n5:7567375 n5:4289935
n4:druhVysledku
n19:D
n4:duvernostUdaju
n10:S
n4:entitaPredkladatele
n18:predkladatel
n4:idSjednocenehoVysledku
162868
n4:idVysledku
RIV/00216305:26220/12:PU101021
n4:jazykVysledku
n21:eng
n4:klicovaSlova
Solder joints, ceramic, wetting angle, shear test.
n4:klicoveSlovo
n8:wetting%20angle n8:ceramic n8:Solder%20joints n8:shear%20test.
n4:kontrolniKodProRIV
[2ADCAA0EEC31]
n4:mistoKonaniAkce
Amsterdam RAI
n4:mistoVydani
Amsterdam, NL
n4:nazevZdroje
4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012
n4:obor
n17:JA
n4:pocetDomacichTvurcuVysledku
4
n4:pocetTvurcuVysledku
4
n4:projekt
n20:2A-1TP1%2F143
n4:rokUplatneniVysledku
n9:2012
n4:tvurceVysledku
Lipavský, Lubomír Szendiuch, Ivan Schnederle, Petr Adámek, Martin
n4:typAkce
n12:WRD
n4:zahajeniAkce
2012-09-17+02:00
s:numberOfPages
5
n11:hasPublisher
Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium
n22:isbn
978-1-4673-4644-3
n23:organizacniJednotka
26220