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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F10%3APU89921%21RIV11-MSM-26220___
rdf:type
skos:Concept n21:Vysledek
dcterms:description
This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology. This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.
dcterms:title
Testing and Simulation of Wire Bonding Attach for higher Current Testing and Simulation of Wire Bonding Attach for higher Current
skos:prefLabel
Testing and Simulation of Wire Bonding Attach for higher Current Testing and Simulation of Wire Bonding Attach for higher Current
skos:notation
RIV/00216305:26220/10:PU89921!RIV11-MSM-26220___
n4:aktivita
n9:Z n9:S
n4:aktivity
S, Z(MSM0021630503)
n4:dodaniDat
n6:2011
n4:domaciTvurceVysledku
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n17:D
n4:duvernostUdaju
n8:S
n4:entitaPredkladatele
n18:predkladatel
n4:idSjednocenehoVysledku
292464
n4:idVysledku
RIV/00216305:26220/10:PU89921
n4:jazykVysledku
n19:eng
n4:klicovaSlova
Testing, current load, wire bonding, simulation
n4:klicoveSlovo
n7:current%20load n7:Testing n7:simulation n7:wire%20bonding
n4:kontrolniKodProRIV
[D196475A9F54]
n4:mistoKonaniAkce
Berlin
n4:mistoVydani
Berlín, Německo
n4:nazevZdroje
Electronics System Integration Technology Conference ESTC 2010 in Berlin
n4:obor
n20:JA
n4:pocetDomacichTvurcuVysledku
4
n4:pocetTvurcuVysledku
5
n4:rokUplatneniVysledku
n6:2010
n4:tvurceVysledku
Buršík, Martin Jankovský, Jaroslav Hejátková, Edita Novotný, Marek Szendiuch, Ivan
n4:typAkce
n11:WRD
n4:zahajeniAkce
2010-09-13+02:00
n4:zamer
n12:MSM0021630503
s:numberOfPages
4
n10:hasPublisher
Neuveden
n15:isbn
978-1-4244-8555-0
n16:organizacniJednotka
26220