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Namespace Prefixes

PrefixIRI
n4http://linked.opendata.cz/ontology/domain/vavai/riv/typAkce/
dctermshttp://purl.org/dc/terms/
n12http://localhost/temp/predkladatel/
n5http://purl.org/net/nknouf/ns/bibtex#
n15http://linked.opendata.cz/resource/domain/vavai/projekt/
n6http://linked.opendata.cz/resource/domain/vavai/riv/tvurce/
n19http://linked.opendata.cz/ontology/domain/vavai/
n21http://linked.opendata.cz/resource/domain/vavai/zamer/
n18https://schema.org/
shttp://schema.org/
skoshttp://www.w3.org/2004/02/skos/core#
n3http://linked.opendata.cz/ontology/domain/vavai/riv/
n11http://linked.opendata.cz/resource/domain/vavai/vysledek/RIV%2F00216305%3A26220%2F10%3APU88085%21RIV11-GA0-26220___/
n2http://linked.opendata.cz/resource/domain/vavai/vysledek/
rdfhttp://www.w3.org/1999/02/22-rdf-syntax-ns#
n17http://linked.opendata.cz/ontology/domain/vavai/riv/klicoveSlovo/
n10http://linked.opendata.cz/ontology/domain/vavai/riv/duvernostUdaju/
xsdhhttp://www.w3.org/2001/XMLSchema#
n20http://linked.opendata.cz/ontology/domain/vavai/riv/jazykVysledku/
n13http://linked.opendata.cz/ontology/domain/vavai/riv/aktivita/
n22http://linked.opendata.cz/ontology/domain/vavai/riv/druhVysledku/
n14http://linked.opendata.cz/ontology/domain/vavai/riv/obor/
n9http://reference.data.gov.uk/id/gregorian-year/

Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F10%3APU88085%21RIV11-GA0-26220___
rdf:type
skos:Concept n19:Vysledek
dcterms:description
Topic of my article is modeling of thermomechanical stressing in modern microelectronic structures. Simulations are made using software ANSYS, which is based on Finite Element Method (FEM). Using this method, thermomechanical stressing in various structures was modeled. After simulations, data evaluation and comparison of yielded results was made to determine amplitudes and differences between stressing in various regions of modeled structure and between individual structures. Topic of my article is modeling of thermomechanical stressing in modern microelectronic structures. Simulations are made using software ANSYS, which is based on Finite Element Method (FEM). Using this method, thermomechanical stressing in various structures was modeled. After simulations, data evaluation and comparison of yielded results was made to determine amplitudes and differences between stressing in various regions of modeled structure and between individual structures.
dcterms:title
Contribution to modeling of stressing in microelectronic structures Contribution to modeling of stressing in microelectronic structures
skos:prefLabel
Contribution to modeling of stressing in microelectronic structures Contribution to modeling of stressing in microelectronic structures
skos:notation
RIV/00216305:26220/10:PU88085!RIV11-GA0-26220___
n3:aktivita
n13:Z n13:S n13:P
n3:aktivity
P(GA102/09/1701), S, Z(MSM0021630503)
n3:dodaniDat
n9:2011
n3:domaciTvurceVysledku
n6:2089882 n6:7567375
n3:druhVysledku
n22:D
n3:duvernostUdaju
n10:S
n3:entitaPredkladatele
n11:predkladatel
n3:idSjednocenehoVysledku
252017
n3:idVysledku
RIV/00216305:26220/10:PU88085
n3:jazykVysledku
n20:eng
n3:klicovaSlova
ANSYS, Stressing, 3D Structures
n3:klicoveSlovo
n17:Stressing n17:ANSYS n17:3D%20Structures
n3:kontrolniKodProRIV
[C5F1EAB2EDF4]
n3:mistoKonaniAkce
Warsaw
n3:mistoVydani
Neuveden
n3:nazevZdroje
ISSE 2008 Conference Proceedings
n3:obor
n14:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:projekt
n15:GA102%2F09%2F1701
n3:rokUplatneniVysledku
n9:2010
n3:tvurceVysledku
Szendiuch, Ivan Pulec, Jiří
n3:typAkce
n4:EUR
n3:zahajeniAkce
2010-05-12+02:00
n3:zamer
n21:MSM0021630503
s:numberOfPages
3
n5:hasPublisher
Neuveden
n18:isbn
978-1-4244-7849-1
n12:organizacniJednotka
26220