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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F10%3APU88083%21RIV11-GA0-26220___
rdf:type
n14:Vysledek skos:Concept
dcterms:description
This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc). This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).
dcterms:title
Contribution to realization of 3D structures Contribution to realization of 3D structures
skos:prefLabel
Contribution to realization of 3D structures Contribution to realization of 3D structures
skos:notation
RIV/00216305:26220/10:PU88083!RIV11-GA0-26220___
n3:aktivita
n17:S n17:P n17:Z
n3:aktivity
P(GA102/09/1701), S, Z(MSM0021630503)
n3:dodaniDat
n19:2011
n3:domaciTvurceVysledku
n7:5896126 n7:3607623 n7:7567375
n3:druhVysledku
n10:D
n3:duvernostUdaju
n20:S
n3:entitaPredkladatele
n11:predkladatel
n3:idSjednocenehoVysledku
252020
n3:idVysledku
RIV/00216305:26220/10:PU88083
n3:jazykVysledku
n13:eng
n3:klicovaSlova
3D, stacked, AL2O3, LTCC
n3:klicoveSlovo
n4:LTCC n4:AL2O3 n4:3D n4:stacked
n3:kontrolniKodProRIV
[C24F794CBD7C]
n3:mistoKonaniAkce
Warsaw
n3:mistoVydani
Warsaw, Poland
n3:nazevZdroje
33rd International Spring Seminar on Electronics Technology (ISSE), 2010
n3:obor
n22:JA
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
3
n3:projekt
n6:GA102%2F09%2F1701
n3:rokUplatneniVysledku
n19:2010
n3:tvurceVysledku
Šandera, Josef Szendiuch, Ivan Nicák, Michal
n3:typAkce
n16:EUR
n3:zahajeniAkce
2010-05-12+02:00
n3:zamer
n18:MSM0021630503
s:numberOfPages
3
n15:hasPublisher
IEEE Xplore digital library
n21:isbn
978-1-4244-7849-1
n9:organizacniJednotka
26220