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Namespace Prefixes

PrefixIRI
n15http://linked.opendata.cz/ontology/domain/vavai/riv/typAkce/
dctermshttp://purl.org/dc/terms/
n13http://purl.org/net/nknouf/ns/bibtex#
n12http://localhost/temp/predkladatel/
n19http://linked.opendata.cz/resource/domain/vavai/projekt/
n9http://linked.opendata.cz/resource/domain/vavai/riv/tvurce/
n8http://linked.opendata.cz/ontology/domain/vavai/
n22https://schema.org/
n20http://linked.opendata.cz/resource/domain/vavai/zamer/
shttp://schema.org/
skoshttp://www.w3.org/2004/02/skos/core#
n4http://linked.opendata.cz/ontology/domain/vavai/riv/
n2http://linked.opendata.cz/resource/domain/vavai/vysledek/
rdfhttp://www.w3.org/1999/02/22-rdf-syntax-ns#
n14http://linked.opendata.cz/ontology/domain/vavai/riv/klicoveSlovo/
n7http://linked.opendata.cz/ontology/domain/vavai/riv/duvernostUdaju/
xsdhhttp://www.w3.org/2001/XMLSchema#
n16http://linked.opendata.cz/ontology/domain/vavai/riv/jazykVysledku/
n10http://linked.opendata.cz/ontology/domain/vavai/riv/aktivita/
n18http://linked.opendata.cz/ontology/domain/vavai/riv/obor/
n17http://linked.opendata.cz/ontology/domain/vavai/riv/druhVysledku/
n11http://reference.data.gov.uk/id/gregorian-year/
n6http://linked.opendata.cz/resource/domain/vavai/vysledek/RIV%2F00216305%3A26220%2F10%3APU87238%21RIV11-GA0-26220___/

Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F10%3APU87238%21RIV11-GA0-26220___
rdf:type
skos:Concept n8:Vysledek
dcterms:description
This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.
dcterms:title
CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES
skos:prefLabel
CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES
skos:notation
RIV/00216305:26220/10:PU87238!RIV11-GA0-26220___
n4:aktivita
n10:Z n10:S n10:P
n4:aktivity
P(GA102/09/1701), S, Z(MSM0021630503)
n4:dodaniDat
n11:2011
n4:domaciTvurceVysledku
n9:3607623 n9:7567375
n4:druhVysledku
n17:D
n4:duvernostUdaju
n7:S
n4:entitaPredkladatele
n6:predkladatel
n4:idSjednocenehoVysledku
252015
n4:idVysledku
RIV/00216305:26220/10:PU87238
n4:jazykVysledku
n16:eng
n4:klicovaSlova
packaging, stacking, 3D structures, lead-free, thick-film
n4:klicoveSlovo
n14:3D%20structures n14:lead-free n14:packaging n14:stacking n14:thick-film
n4:kontrolniKodProRIV
[1A129CDC85BA]
n4:mistoKonaniAkce
Izhevsk
n4:mistoVydani
Izhevsk, Russia
n4:nazevZdroje
Second Forum of Young Researchers. In the framework of International Forum %22Education Quality - 2010%22 : Proceedings
n4:obor
n18:JA
n4:pocetDomacichTvurcuVysledku
2
n4:pocetTvurcuVysledku
2
n4:projekt
n19:GA102%2F09%2F1701
n4:rokUplatneniVysledku
n11:2010
n4:tvurceVysledku
Nicák, Michal Szendiuch, Ivan
n4:typAkce
n15:WRD
n4:zahajeniAkce
2010-04-21+02:00
n4:zamer
n20:MSM0021630503
s:numberOfPages
444
n13:hasPublisher
Publishing House of ISTU
n22:isbn
978-5-7526-0442-3
n12:organizacniJednotka
26220