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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F10%3APU86819%21RIV11-MPO-26220___
rdf:type
skos:Concept n21:Vysledek
dcterms:description
The article treats creep-fatigue models used for lifetime estimate of solder joints. It also states the results of practical measurement (with the use of BGA parts) and the theoretical computation of the lifetime of solder joints soldered with lead-free solder SAC 305. In order to obtain experimental data, the test sample is repeatedly exposed to temperatures ranging from -20 to +100 centigrade, with a dwell time of 15 minutes at maximum and minimum temperature. The experiment is still in progress. In this article, the experimental results of the research will be confronted with the theoretical computations The article treats creep-fatigue models used for lifetime estimate of solder joints. It also states the results of practical measurement (with the use of BGA parts) and the theoretical computation of the lifetime of solder joints soldered with lead-free solder SAC 305. In order to obtain experimental data, the test sample is repeatedly exposed to temperatures ranging from -20 to +100 centigrade, with a dwell time of 15 minutes at maximum and minimum temperature. The experiment is still in progress. In this article, the experimental results of the research will be confronted with the theoretical computations
dcterms:title
The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction
skos:prefLabel
The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction
skos:notation
RIV/00216305:26220/10:PU86819!RIV11-MPO-26220___
n3:aktivita
n10:P
n3:aktivity
P(FR-TI1/072)
n3:dodaniDat
n18:2011
n3:domaciTvurceVysledku
n6:7264321 Švecová, Olga
n3:druhVysledku
n4:D
n3:duvernostUdaju
n15:S
n3:entitaPredkladatele
n8:predkladatel
n3:idSjednocenehoVysledku
294657
n3:idVysledku
RIV/00216305:26220/10:PU86819
n3:jazykVysledku
n5:eng
n3:klicovaSlova
Creep-fatigue models, lead-free solder, solder joint, BGA.
n3:klicoveSlovo
n9:solder%20joint n9:lead-free%20solder n9:BGA. n9:Creep-fatigue%20models
n3:kontrolniKodProRIV
[5FDDD9213FAB]
n3:mistoKonaniAkce
Izhevsk
n3:mistoVydani
Izhevsk, Russia
n3:nazevZdroje
SECOND FORUM OF YOUNG RESEARCHERS In the framework of International Forum %22Education Quality 2010%22
n3:obor
n13:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:projekt
n16:FR-TI1%2F072
n3:rokUplatneniVysledku
n18:2010
n3:tvurceVysledku
Novotný, Václav Švecová, Olga
n3:typAkce
n19:WRD
n3:zahajeniAkce
2010-04-21+02:00
s:numberOfPages
6
n17:hasPublisher
Publishing House of ISTU
n11:isbn
978-5-7526-0442-3
n20:organizacniJednotka
26220