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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F08%3APU74272%21RIV10-MSM-26220___
rdf:type
skos:Concept n5:Vysledek
dcterms:description
This paper deals with analyses of laser-machined vias in LTCC (Low Temperature Cofired Ceramics)-substrates with regard to geometrical performance of holes and electrical characteristics of metalized vias. This paper deals with analyses of laser-machined vias in LTCC (Low Temperature Cofired Ceramics)-substrates with regard to geometrical performance of holes and electrical characteristics of metalized vias.
dcterms:title
Characterization of Laser Drilled Via Interconnections in LTCC Substrates Characterization of Laser Drilled Via Interconnections in LTCC Substrates
skos:prefLabel
Characterization of Laser Drilled Via Interconnections in LTCC Substrates Characterization of Laser Drilled Via Interconnections in LTCC Substrates
skos:notation
RIV/00216305:26220/08:PU74272!RIV10-MSM-26220___
n3:aktivita
n8:Z
n3:aktivity
Z(MSM0021630503)
n3:dodaniDat
n15:2010
n3:domaciTvurceVysledku
n14:5065828 n14:7567375
n3:druhVysledku
n17:D
n3:duvernostUdaju
n20:S
n3:entitaPredkladatele
n12:predkladatel
n3:idSjednocenehoVysledku
359594
n3:idVysledku
RIV/00216305:26220/08:PU74272
n3:jazykVysledku
n18:eng
n3:klicovaSlova
LTCC, via, resistance, laser drilling, via metallisation
n3:klicoveSlovo
n9:via n9:resistance n9:via%20metallisation n9:laser%20drilling n9:LTCC
n3:kontrolniKodProRIV
[F219408E6FC9]
n3:mistoKonaniAkce
Budapest
n3:mistoVydani
Budapest, Hungary
n3:nazevZdroje
ISSE 2008 Abstract Proceedings
n3:obor
n16:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n15:2008
n3:tvurceVysledku
Szendiuch, Ivan Vaněk, Jan
n3:typAkce
n6:WRD
n3:zahajeniAkce
2008-05-07+02:00
n3:zamer
n10:MSM0021630503
s:numberOfPages
2
n19:hasPublisher
Mesterprint Printinghouse Ltd.
n11:isbn
978-963-06-4915-5
n21:organizacniJednotka
26220