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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F04%3APU45759%21RIV%2F2005%2FMSM%2F262205%2FN
rdf:type
skos:Concept n8:Vysledek
dcterms:description
Bezolovnatý pájecí proces nahradí stávající v průběhu roku 2006. Je to dáno ekologickými normami. Proces bezolovnatého pájení vyžaduje znalosti o materiálové i procesní kompatibilitě. Volba materiálu je důležitá pro formování pájeného spoje i pro jeho spolehlivost. Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder jooint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis o Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder jooint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis o
dcterms:title
Solder Wetting of Substrate Surface in Lead Free Soldering Solder Wetting of Substrate Surface in Lead Free Soldering Bezolovnaté pájení a smáčení povrchu substrátu pájkou
skos:prefLabel
Solder Wetting of Substrate Surface in Lead Free Soldering Bezolovnaté pájení a smáčení povrchu substrátu pájkou Solder Wetting of Substrate Surface in Lead Free Soldering
skos:notation
RIV/00216305:26220/04:PU45759!RIV/2005/MSM/262205/N
n3:strany
394-398
n3:aktivita
n5:Z
n3:aktivity
Z(MSM 262200022)
n3:dodaniDat
n6:2005
n3:domaciTvurceVysledku
n13:6286216 n13:9024034
n3:druhVysledku
n17:D
n3:duvernostUdaju
n9:S
n3:entitaPredkladatele
n19:predkladatel
n3:idSjednocenehoVysledku
586908
n3:idVysledku
RIV/00216305:26220/04:PU45759
n3:jazykVysledku
n15:eng
n3:klicovaSlova
lead free, wetting, surface finish, substrate, flux
n3:klicoveSlovo
n12:substrate n12:surface%20finish n12:flux n12:lead%20free n12:wetting
n3:kontrolniKodProRIV
[C850D1BB3867]
n3:mistoKonaniAkce
Brno
n3:mistoVydani
Brno
n3:nazevZdroje
The 11th Electronic Devices and Systems Conference
n3:obor
n14:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:rokUplatneniVysledku
n6:2004
n3:tvurceVysledku
Kazelle, Jiří Starý, Jiří
n3:typAkce
n11:WRD
n3:zahajeniAkce
2004-09-09+02:00
n3:zamer
n16:MSM%20262200022
s:numberOfPages
5
n18:hasPublisher
Vysoké učení technické v Brně
n20:isbn
80-214-2701-9
n21:organizacniJednotka
26220