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Namespace Prefixes

PrefixIRI
n20http://linked.opendata.cz/ontology/domain/vavai/riv/typAkce/
dctermshttp://purl.org/dc/terms/
n18http://localhost/temp/predkladatel/
n14http://purl.org/net/nknouf/ns/bibtex#
n21http://linked.opendata.cz/resource/domain/vavai/projekt/
n9http://linked.opendata.cz/resource/domain/vavai/riv/tvurce/
n10http://linked.opendata.cz/ontology/domain/vavai/
n19https://schema.org/
n15http://linked.opendata.cz/resource/domain/vavai/zamer/
shttp://schema.org/
skoshttp://www.w3.org/2004/02/skos/core#
n5http://linked.opendata.cz/ontology/domain/vavai/riv/
n2http://linked.opendata.cz/resource/domain/vavai/vysledek/
rdfhttp://www.w3.org/1999/02/22-rdf-syntax-ns#
n8http://linked.opendata.cz/resource/domain/vavai/vysledek/RIV%2F00216305%3A26220%2F04%3APU45688%21RIV06-GA0-26220___/
n6http://linked.opendata.cz/ontology/domain/vavai/riv/klicoveSlovo/
n22http://linked.opendata.cz/ontology/domain/vavai/riv/duvernostUdaju/
xsdhhttp://www.w3.org/2001/XMLSchema#
n13http://linked.opendata.cz/ontology/domain/vavai/riv/jazykVysledku/
n11http://linked.opendata.cz/ontology/domain/vavai/riv/aktivita/
n17http://linked.opendata.cz/ontology/domain/vavai/riv/druhVysledku/
n7http://linked.opendata.cz/ontology/domain/vavai/riv/obor/
n12http://reference.data.gov.uk/id/gregorian-year/

Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F04%3APU45688%21RIV06-GA0-26220___
rdf:type
n10:Vysledek skos:Concept
dcterms:description
Investigation of lead-free solders by mechanical tests (creep and stress). Comparation of SnAg, SnAgCu with SnPb. Investigation of lead-free solders by mechanical tests (creep and stress). Comparation of SnAg, SnAgCu with SnPb. V příspěvku je proveden výzkum mechanických vlastností bezolovnatých pájek SnAgCu a SnAg a je provedeno jejich srovnání s poájkou olovnatou.
dcterms:title
Investigation of Creep and Stress Relaxation of Lead-free Solder Joints Investigation of Creep and Stress Relaxation of Lead-free Solder Joints Výzkum mechanických vlastností bezolovnatých pájek
skos:prefLabel
Investigation of Creep and Stress Relaxation of Lead-free Solder Joints Výzkum mechanických vlastností bezolovnatých pájek Investigation of Creep and Stress Relaxation of Lead-free Solder Joints
skos:notation
RIV/00216305:26220/04:PU45688!RIV06-GA0-26220___
n5:strany
1-10
n5:aktivita
n11:P n11:Z
n5:aktivity
P(GA102/04/0590), Z(MSM 262200022)
n5:dodaniDat
n12:2006
n5:domaciTvurceVysledku
n9:7567375
n5:druhVysledku
n17:D
n5:duvernostUdaju
n22:S
n5:entitaPredkladatele
n8:predkladatel
n5:idSjednocenehoVysledku
568887
n5:idVysledku
RIV/00216305:26220/04:PU45688
n5:jazykVysledku
n13:eng
n5:klicovaSlova
lead free soldering, ageing, reliability
n5:klicoveSlovo
n6:ageing n6:lead%20free%20soldering n6:reliability
n5:kontrolniKodProRIV
[A26584B96E7E]
n5:mistoKonaniAkce
Long Beach, USA
n5:mistoVydani
Long Beach
n5:nazevZdroje
37th IMAPS Symposium on Microelectronics
n5:obor
n7:JA
n5:pocetDomacichTvurcuVysledku
1
n5:pocetTvurcuVysledku
1
n5:projekt
n21:GA102%2F04%2F0590
n5:rokUplatneniVysledku
n12:2004
n5:tvurceVysledku
Szendiuch, Ivan
n5:typAkce
n20:WRD
n5:zahajeniAkce
2004-11-14+01:00
n5:zamer
n15:MSM%20262200022
s:numberOfPages
10
n14:hasPublisher
IMAPS USA
n19:isbn
0-930815-74-2
n18:organizacniJednotka
26220