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Statements

Subject Item
n2:RIV%2F00216305%3A26220%2F04%3APU43642%21RIV06-GA0-26220___
rdf:type
n5:Vysledek skos:Concept
dcterms:description
This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today's electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical prooperties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading. This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today's electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical prooperties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading. Příspěvek je zaměřen na termomechaniké modelování dvou substrátů s různým CTE. Jedním z materiálů je laminát FR4, druhým je keramika 96% Al2O3. Spojení substrátů je zajištěno pomocí spojů realizovaných bezolovnatou pájkou SnAgCu. Cílem je popsat vliv rozměrů a tvaru pájených spojů na mechanické napětí v struktuře vznikající.
dcterms:title
Optimizing of Solder Joint Reliability by 3D Modeling Optimizing of Solder Joint Reliability by 3D Modeling Optimalizace spolehlivosti pajenych spoju pomoci 3D modelovani
skos:prefLabel
Optimizing of Solder Joint Reliability by 3D Modeling Optimizing of Solder Joint Reliability by 3D Modeling Optimalizace spolehlivosti pajenych spoju pomoci 3D modelovani
skos:notation
RIV/00216305:26220/04:PU43642!RIV06-GA0-26220___
n3:strany
195-394
n3:aktivita
n6:P n6:Z
n3:aktivity
P(GA102/04/0590), Z(MSM 262200022)
n3:dodaniDat
n21:2006
n3:domaciTvurceVysledku
n8:9466967 n8:7567375
n3:druhVysledku
n11:D
n3:duvernostUdaju
n16:S
n3:entitaPredkladatele
n17:predkladatel
n3:idSjednocenehoVysledku
578344
n3:idVysledku
RIV/00216305:26220/04:PU43642
n3:jazykVysledku
n13:eng
n3:klicovaSlova
solder joint reliability, modelling, ANSYS
n3:klicoveSlovo
n4:modelling n4:solder%20joint%20reliability n4:ANSYS
n3:kontrolniKodProRIV
[6E7CB830336D]
n3:mistoKonaniAkce
Prague
n3:mistoVydani
Lanskroun
n3:nazevZdroje
Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition
n3:obor
n10:JA
n3:pocetDomacichTvurcuVysledku
2
n3:pocetTvurcuVysledku
2
n3:projekt
n9:GA102%2F04%2F0590
n3:rokUplatneniVysledku
n21:2004
n3:tvurceVysledku
Bulva, Jindřich Szendiuch, Ivan
n3:typAkce
n15:WRD
n3:zahajeniAkce
2004-06-16+02:00
n3:zamer
n20:MSM%20262200022
s:numberOfPages
200
n19:hasPublisher
IMAPS CZ&SK Chapter
n12:isbn
80-239-2835-X
n18:organizacniJednotka
26220