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Statements

Subject Item
n2:RIV%2F00216305%3A26210%2F09%3APU83814%21RIV10-MSM-26210___
rdf:type
n6:Vysledek skos:Concept
dcterms:description
Ultra-fine grained (UFG) materials belong nowadays to front line areas of research in material sciences. The UFG structure can be obtained by means of the equal channel angular pressing (ECAP). We report on study of the grain structure in ECAPed copper using the cathode lens equipped ultrahigh vacuum scanning low energy electron microscope (UHV SLEEM). The grain contrast was found achieving its maximum at electron energies below about 30 eV where it exhibited dependence on electron energy specific for the grain orientation. The energy dependence of the slow electron reflectance seemed to be capable of serving as a fingerprint enabling determination of the crystalline orientation. The very low energy electron reflectance might become an alternative to the electron backscatter diffraction method owing to its high resolution and fast data acquisition. Ultra-fine grained (UFG) materials belong nowadays to front line areas of research in material sciences. The UFG structure can be obtained by means of the equal channel angular pressing (ECAP). We report on study of the grain structure in ECAPed copper using the cathode lens equipped ultrahigh vacuum scanning low energy electron microscope (UHV SLEEM). The grain contrast was found achieving its maximum at electron energies below about 30 eV where it exhibited dependence on electron energy specific for the grain orientation. The energy dependence of the slow electron reflectance seemed to be capable of serving as a fingerprint enabling determination of the crystalline orientation. The very low energy electron reflectance might become an alternative to the electron backscatter diffraction method owing to its high resolution and fast data acquisition.
dcterms:title
Microstructure of ultra-fine grained Cu by UHV SLEEM Microstructure of ultra-fine grained Cu by UHV SLEEM
skos:prefLabel
Microstructure of ultra-fine grained Cu by UHV SLEEM Microstructure of ultra-fine grained Cu by UHV SLEEM
skos:notation
RIV/00216305:26210/09:PU83814!RIV10-MSM-26210___
n4:aktivita
n16:S
n4:aktivity
S
n4:dodaniDat
n7:2010
n4:domaciTvurceVysledku
n5:6142826 n5:5357020 n5:6440959
n4:druhVysledku
n13:O
n4:duvernostUdaju
n10:S
n4:entitaPredkladatele
n15:predkladatel
n4:idSjednocenehoVysledku
326252
n4:idVysledku
RIV/00216305:26210/09:PU83814
n4:jazykVysledku
n11:eng
n4:klicovaSlova
UHV SLEEM, EBSD, ultra-fine grained structure
n4:klicoveSlovo
n9:EBSD n9:ultra-fine%20grained%20structure n9:UHV%20SLEEM
n4:kontrolniKodProRIV
[09894356B819]
n4:obor
n14:JG
n4:pocetDomacichTvurcuVysledku
3
n4:pocetTvurcuVysledku
6
n4:rokUplatneniVysledku
n7:2009
n4:tvurceVysledku
Frank, Luděk Man, Ondřej Müllerová, Ilona Hovorka, Miloš Mikmeková, Šárka Pantělejev, Libor
n12:organizacniJednotka
26210