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Statements

Subject Item
n2:RIV%2F00216224%3A14310%2F10%3A00049625%21RIV12-GA0-14310___
rdf:type
n10:Vysledek skos:Concept
dcterms:description
Sintering effect of Ag nanoparticles studied in this work seems to be an interesting alternative of lead-free soldering. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique. Sintering effect of Ag nanoparticles studied in this work seems to be an interesting alternative of lead-free soldering. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
dcterms:title
Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere
skos:prefLabel
Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere
skos:notation
RIV/00216224:14310/10:00049625!RIV12-GA0-14310___
n3:aktivita
n17:S n17:P
n3:aktivity
P(GA106/09/0700), S
n3:dodaniDat
n12:2012
n3:domaciTvurceVysledku
n5:2794918 n5:1631055 n5:5823803
n3:druhVysledku
n21:D
n3:duvernostUdaju
n9:S
n3:entitaPredkladatele
n18:predkladatel
n3:idSjednocenehoVysledku
264399
n3:idVysledku
RIV/00216224:14310/10:00049625
n3:jazykVysledku
n20:eng
n3:klicovaSlova
Soldering nanopowder substrate characterisation
n3:klicoveSlovo
n15:Soldering%20nanopowder%20substrate%20characterisation
n3:kontrolniKodProRIV
[37EBBAB216A0]
n3:mistoKonaniAkce
Anaheim (CA)
n3:mistoVydani
Danville, CA 94526, U.S.A.
n3:nazevZdroje
TechConnect WORLD Conference & Expo 2010
n3:obor
n14:CF
n3:pocetDomacichTvurcuVysledku
3
n3:pocetTvurcuVysledku
5
n3:projekt
n4:GA106%2F09%2F0700
n3:rokUplatneniVysledku
n12:2010
n3:tvurceVysledku
Buršík, Jiří Brož, Pavel Zálešák, Jakub Sopoušek, Jiří Buršíková, Vilma
n3:typAkce
n6:WRD
n3:zahajeniAkce
2010-06-21+02:00
s:numberOfPages
2
n8:hasPublisher
Nano Science and Technology Institute
n13:isbn
978-1-4398-3421-3
n7:organizacniJednotka
14310