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Statements

Subject Item

n2:7E11008

rdf:type

n3:Projekt

dcterms:description

The packaging of future Integrated Modular electronics objective is to develop a new flexible, robust and open commercial aeronautical packaging of embedded electronics for future aircraft. This new standard will be able to replace the 35 year old ARINC 600 standard, integrating the new archtecture concepts and technologies trends. The project is an enabling key building block for the next generation of electronics and particulary to Integrated Modular Avionics for future large and regional aircraft. Project objectives are: 1. reduce electronics packaging in terms of volume (50%) and weight(30%) and offer flexibility and growth capability 2. reduce costs (20%)using market standard components 3. enhance reliability (50%)through thermal and vibration improvement 4. mitigate EMC protection penalties in composite fuselage environment 5. ensure fast production ramp up and support rapid final assembly on Aircraft 6. improve availability and reduce maintenance cost 7. using of composite materials for packaging The packaging of future Integrated Modular electronics objective is to develop a new flexible, robust and open commercial aeronautical packaging of embedded electronics for future aircraft. This new standard will be able to replace the 35 year old ARINC 600 standard, integrating the new archtecture concepts and technologies trends. The project is an enabling key building block for the next generation of electronics and particulary to Integrated Modular Avionics for future large and regional aircraft. Project objectives are: 1. reduce electronics packaging in terms of volume (50%) and weight(30%) and offer flexibility and growth capability 2. reduce costs (20%)using market standard components 3. enhance reliability (50%)through thermal and vibration improvement 4. mitigate EMC protection penalties in composite fuselage environment 5. ensure fast production ramp up and support rapid final assembly on Aircraft 6. improve availability and reduce maintenance cost 7. using of composite materials for packaging

dcterms:title

The Packaging of futuRe Integrated ModulAr Electronics The Packaging of futuRe Integrated ModulAr Electronics

n3:cislo-smlouvy

n11:2011 \u2013 321

n3:druh-souteze

n13:RP

n3:faze

n7:54616222

n3:hlavni-obor

n9:JU

n3:vedlejsi-obor

n9:JA

n3:id-aktivity

n8:7E

n3:id-souteze

n10:

n3:kategorie

n12:2

n3:klicova-slova

Packaging; Cooling; Avionics; Modular Integrated Packaging; Key Building

n3:konec-reseni

2014-04-30+01:00

n3:pocet-koordinujicich-prijemcu

0

n3:poskytovatel

n4:MSM

n3:start-reseni

2011-01-01+01:00

n3:statni-podpora

1829

n3:typProjektu

n6:P

n3:uznane-naklady

1829

n3:pocet-prijemcu

1

n3:pocet-spoluprijemcu

0

n3:pocet-vysledku

0

n3:pocet-vysledku-zverejnovanych

0