About: Modelling of Thermal Stresses in Printed Circuit Boards

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters. Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters. (en)
Title	Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards (en)
skos:prefLabel	Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards (en)
skos:notation	RIV/70883521:28110/11:43866460!RIV12-MSM-28110___
http://linked.open...avai/predkladatel	Fakulta technologická
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(ED2.1.00/03.0089), Z(MSM7088352102)
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Sýkorová, Libuše Šuba, Oldřich Šanda, Štěpán Staněk, Michal
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Univerzita Tomáše Bati ve Zlíně / Fakulta technologická
http://linked.open...dnocenehoVysledku	213126
http://linked.open...ai/riv/idVysledku	RIV/70883521:28110/11:43866460
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Printed Circuit Boards, Thermal Stresses, Modelling (en)
http://linked.open.../riv/klicoveSlovo	Printed Circuit Boards Thermal Stresses Modelling
http://linked.open...ontrolniKodProRIV	[8C89EF69C9BF]
http://linked.open...v/mistoKonaniAkce	Lanzarote
http://linked.open...i/riv/mistoVydani	Montreux
http://linked.open...i/riv/nazevZdroje	Recent Researches in Automatic Control
http://linked.open...in/vavai/riv/obor	JP
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...vavai/riv/projekt	The Centre of Security, Information and Advanced Technologies (CEBIA-Tech)
http://linked.open...UplatneniVysledku	2011
http://linked.open...iv/tvurceVysledku	Sýkorová, Libuše Staněk, Michal Šanda, Štěpán Šuba, Oldřich
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2011-05-27 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Modeling and Control of Processing Procedures of Natural and Synthetic Polymers
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	WSEAS Press
https://schema.org/isbn	978-1-61804-004-6
http://localhost/t...ganizacniJednotka	28110
is http://linked.open...avai/riv/vysledek of	Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards

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