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  • Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.
  • Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters. (en)
Title
  • Transient of thermal stresses in printed circuit boards
  • Transient of thermal stresses in printed circuit boards (en)
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  • Transient of thermal stresses in printed circuit boards
  • Transient of thermal stresses in printed circuit boards (en)
skos:notation
  • RIV/70883521:28110/11:43865257!RIV12-MSM-28110___
http://linked.open...avai/predkladatel
http://linked.open...avai/riv/aktivita
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  • Z(MSM7088352102)
http://linked.open...iv/cisloPeriodika
  • 3
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
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  • 235830
http://linked.open...ai/riv/idVysledku
  • RIV/70883521:28110/11:43865257
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • Thermal stress, Printed circuit boards, Layered walls. (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • US - Spojené státy americké
http://linked.open...ontrolniKodProRIV
  • [A1888ADCA0A8]
http://linked.open...i/riv/nazevZdroje
  • International Journal of Mechanics
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
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http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 5
http://linked.open...iv/tvurceVysledku
  • Sýkorová, Libuše
  • Šuba, Oldřich
http://linked.open...n/vavai/riv/zamer
issn
  • 1998-4448
number of pages
http://localhost/t...ganizacniJednotka
  • 28110
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