About: Measurements of solder paste viscosity during its tempering and aging

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887590&isnumber=6887550
Description	Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion, viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during its tempering and aging with possibility of regeneration of solder paste properties by jelly flux. Three types of solder pastes were used in the experiment: Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5 and Sn62Pb36Ag2. Viscosity of solder paste is measured from storing temperature to the ambient temperature. Aging of solder pastes is made in ambient atmosphere. Regeneration of solder paste properties after aging was done by adding of jelly flux Amtech 4300/LF-4300-TF. The viscosity of pure solder paste before aging, pure solder paste after aging and solder paste after aging regenerated by jelly flux was measured by rotation viscometer Brookfield Synchroelectric Viscometer, model HBT. The article describes if the addition of jelly flux to the aged solder pastes regenerates their properties. Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion, viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during its tempering and aging with possibility of regeneration of solder paste properties by jelly flux. Three types of solder pastes were used in the experiment: Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5 and Sn62Pb36Ag2. Viscosity of solder paste is measured from storing temperature to the ambient temperature. Aging of solder pastes is made in ambient atmosphere. Regeneration of solder paste properties after aging was done by adding of jelly flux Amtech 4300/LF-4300-TF. The viscosity of pure solder paste before aging, pure solder paste after aging and solder paste after aging regenerated by jelly flux was measured by rotation viscometer Brookfield Synchroelectric Viscometer, model HBT. The article describes if the addition of jelly flux to the aged solder pastes regenerates their properties. (en)
Title	Measurements of solder paste viscosity during its tempering and aging Measurements of solder paste viscosity during its tempering and aging (en)
skos:prefLabel	Measurements of solder paste viscosity during its tempering and aging Measurements of solder paste viscosity during its tempering and aging (en)
skos:notation	RIV/68407700:21230/14:00221828!RIV15-MSM-21230___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2015
http://linked.open...aciTvurceVysledku	Dušek, Karel Bušek, David Beshajová Pelikánová, Ivana Zeidler, Marek
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	27968
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/14:00221828
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Solder paste; Viscosity Measurement; Aging (en)
http://linked.open.../riv/klicoveSlovo	Aging Solder paste Viscosity Measurement
http://linked.open...ontrolniKodProRIV	[A0E50502CAF0]
http://linked.open...v/mistoKonaniAkce	Drážďany
http://linked.open...i/riv/mistoVydani	New York
http://linked.open...i/riv/nazevZdroje	37th Int. Spring Seminar on Electronics Technology
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...UplatneniVysledku	2014
http://linked.open...iv/tvurceVysledku	Beshajová Pelikánová, Ivana Bušek, David Dušek, Karel Zeidler, Marek
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2014-05-07 (xsd:date)
number of pages	4 (xsd:int)
http://bibframe.org/vocab/doi	10.1109/ISSE.2014.6887590
http://purl.org/ne...btex#hasPublisher	IEEE
https://schema.org/isbn	978-1-4799-4455-2
http://localhost/t...ganizacniJednotka	21230

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